Wafer-scale testing of photonic integrated circuits using horizontal spot-size converters

Patent metadata

Field	Value
Publication number	US-9922887-B2
Application number	US-201314103659-A
Country	US
Kind code	B2
Filing date	Dec 11, 2013
Priority date	Dec 11, 2012
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.

First claim

The invention claimed is:

1. A method, comprising:
obtaining a wafer comprising a plurality of photonic integrated circuits wherein a first photonic integrated circuit of the plurality of photonic integrated circuits comprises a test circuit and a second photonic integrated circuit of the plurality of photonic integrated circuits comprises a horizontal spot-size converter;
coupling light to the test circuit using a grating coupler disposed on a surface of the first photonic integrated circuit, wherein the light is out-of-plane with respect to the surface; and
operating the test circuit to test the second photonic integrated circuit via the horizontal spot-size converter.

2. The method according to claim 1 , further comprising obtaining a plurality of chips by dicing a portion of the plurality of photonic integrated circuits off the wafer.

3. The method according to claim 1 , wherein the test circuit comprises a polarization splitter.

4. The method of claim 1 , wherein the horizontal spot-size converter is a first horizontal spot-size converter, and wherein operating the test circuit to test the second photonic integrated circuit via the horizontal spot-size converter comprises optically coupling a second horizontal spot-size converter disposed on the first photonic integrated circuit to the first horizontal spot-size converter.

5. The method of claim 1 , wherein operating the test circuit comprises splitting polarization of a test signal and providing the test signal over a trench.

6. The method of claim 1 , further comprising filling a region formed between the first photonic integrated circuit and the second photonic integrated circuit with a fluid.

7. The method of claim 1 , further comprising separating the light into two or more polarization components, and wherein operating the test circuit to test the second photonic integrated circuit comprises coupling at least one of the two or more polarization components between the test circuit and the horizontal spot-size converter.

8. The method according to claim 1 , wherein the first photonic integrated circuit is in a neighboring relationship to the second photonic integrated circuit.

9. The method according to claim 5 , wherein operating the test circuit to test the second photonic integrated circuit via the horizontal spot-size converter comprises optically coupling the test circuit to the horizontal spot-size converter through a trench.

10. The method according to claim 1 , wherein the second photonic integrated circuit further comprises an intermediate waveguide optically coupled to the horizontal spot-size converter,
wherein the horizontal spot-size converter and the intermediate waveguide are made of different materials.

11. The method according to claim 10 , wherein the intermediate waveguide is cantilevered.

12. The method according to claim 11 , wherein the cantilevered intermediate waveguide is adjacent a region that is filled with a fluid.

13. An apparatus comprising:
a wafer comprising a plurality of photonic integrated circuits;
a first photonic integrated circuit of the plurality of photonic integrated circuits comprising a test circuit;
a second photonic integrated circuit of the plurality of photonic integrated circuits comprising a horizontal spot-size converter, wherein the horizontal spot-size converter is an inverted taper;
wherein the test circuit is configured to test the second photonic integrated circuit via the horizontal spot-size converter.

14. The apparatus according to claim 13 ,
wherein the second photonic integrated circuit comprises an intermediate waveguide optically coupled to the inverted taper;
wherein the inverted taper and the intermediate waveguide are made of different materials.

15. The apparatus according to claim 13 , wherein the test circuit comprises a grating coupler.

16. The apparatus of claim 13 , wherein the test circuit comprises a polarization splitter.

17. The apparatus of claim 13 , wherein the horizontal spot-size converter is a first horizontal spot-size converter, and wherein the first photonic integrated circuit further comprises a second horizontal spot-size converter configured to optically couple the test circuit to the first horizontal spot-size converter.

18. The apparatus of claim 13 , wherein the wafer is at least partially made of silicon.

19. The apparatus according to claim 13 , wherein the test circuit is configured to optically couple to the horizontal spot-size converter through a trench.

20. The apparatus according to claim 19 , wherein the horizontal spot-size converter forms an angle with respect to a normal to the trench that is greater than zero.

Assignees

• Acacia Communications Inc

Inventors

• Vermeulen Diedrik
• Chen Long
• Doerr Christopher

Classifications

• H10P74/27

  Structural arrangements therefor · CPC title

• H10P74/20 Primary

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• G01M11/37

  in which light is projected perpendicularly to the axis of the fibre or waveguide for monitoring a section thereof · CPC title

• G02B6/1223

  high refractive index type, i.e. high-contrast waveguides · CPC title

• G02B6/34

  utilising prism or grating {(G02B6/293 takes precedence)} · CPC title