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US-2024379467-A1 · Nov 14, 2024 · US
Thermal interface material on package
US2015364342A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015364342-A1 |
| Application number | US-201514836454-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 26, 2015 |
| Priority date | Jan 23, 2014 |
| Publication date | Dec 17, 2015 |
| Grant date | — |
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Abstract
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A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method, comprising: dispensing a thermal interface material (TIM) on an electronic assembly; removing volatile species of the TIM, prior to lid placement on the electronic assembly; placing the lid on the TIM, over the electronic assembly; and pressing the lid onto the electronic assembly, wherein the removal of the volatile species comprises subjecting the TIM to a predetermined temperature, in an oven, for a predetermined time period.…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015364342A1 cover?
- A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H10P74/23. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).