Apparatus and method for measuring thickness and temperature and substrate processing system

Patent metadata

Field	Value
Publication number	US-9163931-B2
Application number	US-201414576478-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Dec 20, 2013
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

An apparatus for measuring a thickness or wear amount and a temperature of the ceramic member by using a terahertz wave includes a terahertz wave generating unit configured to output a terahertz wave, a terahertz wave analysis unit configured to analyze a terahertz wave and an optical system configured to guide the terahertz wave output from the terahertz wave generating unit to the ceramic member and guide reflected waves of the terahertz wave reflected from the ceramic member to the terahertz wave analysis unit. The terahertz wave analysis unit obtains an optical path difference between a first reflection wave reflected from a front surface of the ceramic member and a second reflection wave reflected from a rear surface of the ceramic member and measures a thickness of the ceramic member based on the optical path difference.

First claim

What is claimed is:

1. An apparatus for measuring at least a thickness of a ceramic member provided in a chamber maintained in a vacuum atmosphere, the apparatus comprising:
a terahertz wave generating unit configured to output a terahertz wave;
a terahertz wave analysis unit configured to analyze a terahertz wave; and
an optical system configured to guide the terahertz wave output from the terahertz wave generating unit to the ceramic member and guide reflected waves of the t…

Assignees

• Tokyo Electron Ltd

Inventors

• Matsudo Tatsuo
• Koshimizu Chishio

Classifications

• H10P72/0604

  Electricity · mapped topic

• H10P72/0421

  Electricity · mapped topic

• G01K5/48

  Physics · mapped topic

• G01K11/006

  Physics · mapped topic

• H01L22/12

  Electricity · mapped topic