Bendable carrier mount, device and method for releasing a carrier substrate

Patent metadata

Field	Value
Publication number	US-9296193-B2
Application number	US-201114008696-A
Country	US
Kind code	B2
Filing date	Apr 11, 2011
Priority date	Apr 11, 2011
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

First claim

The invention claimed is:

1. Device for detaching a carrier substrate from a semiconductor product substrate in a detachment direction (L) wherein said detachment direction (L) is generally normal to a planar surface of said semiconductor product substrate, said device comprising:
a carrier mount for holding the carrier substrate, said carrier mount including:
an open ring that is flexible in the detachment direction (L) and configured to bend relative to said planar surface of the semiconductor product substrate such that at least one side of the open ring is offset above a remaining portion of the open ring to bend the carrier substrate, said open ring of said carrier mount having an adjustable diameter (D k ),

a substrate mount for holding the semiconductor product substrate, and
detachment means for debonding of the carrier substrate from the semiconductor product substrate while bending the carrier substrate in said detachment direction (L), said detachment means including:
drive means for applying at least one tensile force (F 1 , F 2 , F n ) to said substrate mount in said detachment direction (L) and
fixing means for applying at least one opposing force (G) to said carrier mount in a direction generally opposite said at least one tensile force (F 1 , F 2 , F n ).

2. Device as claimed in claim 1 , wherein the carrier mount is elastically deformable in the detachment direction (L).

3. Device as claimed in claim 1 , wherein said drive means of said detachment means applies said at least one tensile force (F 1 , F 2 , F n ) on the periphery of the substrate mount and said fixing means of said detachment means applies said at least one opposing force (G) acting against the tensile force (F 1 , F 2 , F n ) on the periphery of the carrier mount to produce detachment moments (K 1 , K 2 , K n ) along a detachment front.

4. Device as claimed in claim 1 , wherein the substrate mount is a rigid substrate mount having a surface that engages an entire surface of the semiconductor product substrate.

5. Device as claimed in claim 1 , wherein said detachment direction (L) extends in a generally vertical direction and said drive means of said detachment means moves said substrate mount in said detachment direction (L).

6. Device as claimed in claim 1 , wherein said drive means applies said at least one tensile force (F 1 , F 2 , F n ) to said substrate mount in said detachment direction (L) and said fixing means applies said at least one opposing force (G) to said carrier mount to fix at least one side of said carrier mount relative to said detachment direction (L).

7. Device as claimed in claim 1 , further comprising a control device that controls operation of the detachment means and thereby controls application of a plurality of said tensile forces (F 1 , F 2 , F n ) to the substrate mount, wherein each of said plurality of said tensile forces (F 1 , F 2 , F n ) is applied at different locations on a periphery of the substrate mount to debond the carrier substrate from the semiconductor product substrate concentrically from the periphery of the semiconductor product substrate to a center of the semiconductor product substrate.

8. Device as claimed in claim 1 , further comprising a control device that controls operation of the detachment means and thereby controls application of a plurality of said tensile forces (F 1 , F 2 , F n ) to the substrate mount, wherein each of said plurality of said tensile forces (F 1 , F 2 , F n ) is applied at different locations on a periphery of the substrate mount to debond the carrier substrate from the semiconductor product substrate in a spiral pattern from the periphery of the semiconductor product substrate to a center of the semiconductor product substrate.

9. Device as claimed in claim 1 , wherein said open ring includes:
an inside surface defining a first opening having an inside diameter (D i );
a ring shoulder providing a lower surface; and
a peripheral shoulder extending away from the ring shoulder, said peripheral shoulder comprised of:
(i) a face surface extending generally parallel to the lower surface of the ring shoulder, and
(ii) a sloping surface extending between the face surface and the lower surface of the ring shoulder, said sloping surface meeting the face surface at an inner edge, wherein said sloping surface defines a second opening having a diameter that increases from the face surface to the lower surface of the ring shoulder and wherein the adjustable diameter (D k ) is defined by the inner edge.

10. Method for detaching a carrier substrate from a substantially planar semiconductor product substrate in a detachment direction (L) wherein said detachment direction (L) is generally normal to a substantially planar surface of said semiconductor product substrate, said method comprising:
mounting the semiconductor product substrate to a substrate mount;
mounting the carrier substrate to a carrier mount which is flexible in the detachment direction (L) for bending of the carrier substrate, said carrier mount including an open ring with an adjustable diameter (D k );
applying at least one tensile force (F 1 , F 2 , F n ) to said substrate mount in a first direction; and
applying at least one opposing force (G) to said carrier mount in a second direction, said first direction being generally opposite to said second direction, wherein the carrier substrate mounted to the carrier mount bends in the detachment direction (L) to detach the carrier substrate from the semiconductor product substrate.

11. Method as claimed in claim 10 , wherein said detachment direction (L) extends in a generally vertical direction and said substrate mount moves in said detachment direction (L).

12. Method as claimed in claim 10 , wherein at least one side of said carrier mount is fixed to a predetermined position relative to said detachment direction (L) and at least one opposite side of said carrier mount is free to move in the detachment direction (L).

13. Flexible carrier mount for holding a carrier substrate in a process for detaching the carrier substrate from a semiconductor product substrate connected thereto, wherein the carrier mount is engageable by detachment means to bend the carrier substrate held by the carrier mount and thereby debond the carrier substrate from the semiconductor substrate, said carrier mount comprising:
an open ring including:
an inside surface defining a first opening having an inside diameter (D i );
a ring shoulder providing a lower surface; and
a peripheral shoulder extending away from the ring shoulder, said peripheral shoulder comprised of:
(i) a face surface extending generally parallel to the lower surface of the ring shoulder, and
(ii) a sloping surface extending between the face surface and the lower surface of the ring shoulder, said sloping surface meeting the face surface at an inner edge, wherein said sloping surface defines a second opening having a diameter that increases from the face surface to the lower surface of the ring shoulder, the second opening having a diameter (D k ) defined by the inner edge.

14. Flexible carrier mount as claimed in claim 13 , wherein an angle (I) between the sloping surface of the peripheral shoulder and the lower surface of the ring shoulder is greater than 45° and less than 90°.

15. Flexible carrier mount as claimed in claim 13 , wherein said lower surface of the ring shoulder, the sloping surface of the peripheral shoulder, and the face surface of the peripheral shoulder form a Z-shaped step.

16. Flexible carrier mount as claimed in claim 13 , wherein a distance (M) between t

Assignees

• Burggraf Jürgen
• Burgstaller Daniel
• Ev Group E Thallner Gmbh

Inventors

• Burggraf Jürgen
• Burgstaller Daniel

Classifications

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/7444

  using a peeling wedge, a knife or a bar · CPC title

• H10P72/1921

  characterised by substrate supports · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/14

  Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls · CPC title