Semiconductor wafer processing tool with improved leak check
US-2024084445-A1 · Mar 14, 2024 · US
US9914997B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9914997-B2 |
| Application number | US-201414772679-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 28, 2014 |
| Priority date | Apr 10, 2013 |
| Publication date | Mar 13, 2018 |
| Grant date | Mar 13, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A method for supplying a process with an enriched carrier gas. A first apparatus and a second apparatus are provided. The first apparatus has a precursor and is configured to bring a carrier gas into contact with the precursor and to enrich the carrier gas with the precursor. The second apparatus has a precursor and is configured to bring a carrier gas into contact with the precursor and to enrich the carrier gas with the precursor. The first apparatus supplies the second apparatus with an enriched carrier gas. The second apparatus supplies the enriched carrier gas for the process. A temperature of the first apparatus is controlled as a function of a quantity of precursor in the second apparatus.
Opening claim text (preview).
The invention claimed is: 1. A method for supplying a process with an enriched carrier gas, wherein: a first apparatus and a second apparatus are provided, the first apparatus has a precursor and is configured to bring a carrier gas into contact with the precursor and to enrich said carrier gas with the precursor, the second apparatus has a precursor and is configured to bring a carrier gas into contact with the precursor and to enrich said carrier gas with the precursor, the first apparatus supplies the second apparatus with an enriched carrier gas, wherein the second apparatus supplies the enriched carrier gas for the process, and a temperature of the first apparatus is controlled as a function of a quantity of precursor in the second apparatus. 2. The method according to claim 1 , wherein the temperature of the first apparatus is set such that more precursor is transported from the first apparatus to the second apparatus than is output for the process by the second apparatus via the enriched carrier gas. 3. The method according claim 1 , wherein the temperature of the first apparatus is controlled as a function of the quantity of precursor in the first apparatus. 4. The method according to claim 1 , wherein the quantity of precursor in the first and/or second apparatus is gauged as a function of the weight of the first or second apparatus respectively. 5. The method according to claim 1 , wherein the temperature of the second apparatus is controlled independently of the temperature of the first apparatus. 6. The method according to claim 1 , wherein a liquid precursor is provided as precursor at least in the first or the second apparatus, and wherein the apparatus with the liquid precursor takes the form of a bubbler. 7. The method of claim 1 , wherein a liquid precursor, which is an organometallic precursor, is provided as precursor at least in the first or the second apparatus, and wherein the apparatus with the liquid precursor takes the form of a bubbler for enriching the carrier gas with a precursor, said bubbler comprising: a chamber for holding the liquid precursor; a temperature control means, having insulation, which is arranged on the outside of the temperature means, having an inflow pipe for supplying carrier gas, wherein the inflow pipe projects into the chamber; and an outflow pipe for removing the enriched carrier gas, which projects into the chamber, wherein at least one deflection element is provided between an outlet of the inflow pipe and the inlet of the outflow pipe to influence flow of the carrier gas, wherein in operation the deflection element is arranged in the liquid precursor. 8. The method of claim 7 , wherein a plurality of deflection elements are arranged one above the other between an outlet orifice of the inflow pipe and an outflow orifice of the outflow pipe. 9. The method of claim 7 , wherein at least one deflection element takes the form of a plate with holes. 10. The method of claim 7 , wherein at least one deflection element takes the form of a plate with inclined surfaces. 11. The method of claim 10 , wherein the deflection element with the holes is arranged as first deflection element above the outlet orifice of the inflow pipe. 12. The method of claim 11 , wherein at least two further deflection elements are arranged above the first deflection element and below the outflow orifice of the outflow pipe, wherein the two further deflection elements take the form of plates with inclined surfaces, wherein the surfaces take the form of segments of circles. 13. The method according to claim 5 , wherein the temperature of the second apparatus is controlled independently of the temperature of the first apparatus as a function of the quantity of precursor in the second apparatus and/or as a function of the volumetric flow rate of the carrier gas through the second apparatus and/or as a function of a desired saturation of the carrier gas for the process. 14. The method according to claim 6 , wherein said liquid precursor is an organometallic precursor. 15. The method of claim 10 , wherein said inclined surfaces take the form of segments of circles.
Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title
from metallo-organic compounds · CPC title
by bubbling of carrier gas through liquid source material · CPC title
by evaporation using carrier gas in contact with the source material (C23C16/4486 takes precedence) · CPC title
with heated gases or vapours {or liquids} in contact with the liquid · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.