Semiconductor wafer processing tool with improved leak check
US-2024084445-A1 · Mar 14, 2024 · US
by bubbling of carrier gas through liquid source material
by bubbling of carrier gas through liquid source material · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C16/4482 |
| Official title | {by bubbling of carrier gas through liquid source material} |
| Display label | by bubbling of carrier gas through liquid source material |
| Total patents | 196 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 14 |
| 2017 | 17 |
| 2018 | 18 |
| 2019 | 12 |
| 2020 | 16 |
| 2021 | 18 |
| 2022 | 14 |
| 2023 | 24 |
| 2024 | 26 |
| 2025 | 18 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Elimination of H2S in Immersion Tin Plating Solution
US-2018347038-A1 · Dec 6, 2018 · US
Processing gas generating apparatus, processing gas generating method, substrate processing method, and storage medium
US-10141209-B2 · Nov 27, 2018 · US
Gas control system and program for gas control system
US-10138555-B2 · Nov 27, 2018 · US
Vapor phase growth apparatus, storage container, and vapor phase growth method
US-10109483-B2 · Oct 23, 2018 · US
Gas control system, deposition apparatus including gas control system, and program and gas control method used for gas control system
US-2018258530-A1 · Sep 13, 2018 · US
Apparatus for Increasing Flux from an Ampoule
US-2018250695-A1 · Sep 6, 2018 · US
Organodisilane precursors for ALD/CVD silicon-containing film applications
US-10006122-B2 · Jun 26, 2018 · US
Precursor control system and process
US-2018163307-A1 · Jun 14, 2018 · US
Raw material vaporization and supply apparatus
US-9994955-B2 · Jun 12, 2018 · US
Systems and methods for bulk vaporization of precursor
US-9964332-B2 · May 8, 2018 · US
Method for supplying a process with an enriched carrier gas
US-9914997-B2 · Mar 13, 2018 · US
Methods of vapor deposition with multiple vapor sources
US-9873942-B2 · Jan 23, 2018 · US
Solid precursor delivery method using liquid solvent for thin film deposition
US-9869018-B2 · Jan 16, 2018 · US
Aluminum precursors for thin-film deposition, preparation method and use thereof
US-2017327944-A1 · Nov 16, 2017 · US
Delivery Container with Flow Distributor
US-2017327945-A1 · Nov 16, 2017 · US
Solid Precursor Delivery Method Using Liquid Solvent for Thin Film Deposition
US-2017306485-A1 · Oct 26, 2017 · US
Organodisilane precursors for ald/cvd silicon-containing film applications
US-2017298510-A1 · Oct 19, 2017 · US
Film forming method and film forming device
US-9777377-B2 · Oct 3, 2017 · US
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Recording Medium
US-2017263439-A1 · Sep 14, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C16/4482?
- CPC C23C16/4482 is the Cooperative Patent Classification code for “by bubbling of carrier gas through liquid source material.”
- How many patents are filed under CPC C23C16/4482 (by bubbling of carrier gas through liquid source material)?
- Our database includes 196 publications tagged with this CPC code.
- Is patent activity under CPC C23C16/4482 growing?
- Publication counts under this code: 26 in 2024 vs 18 in 2025 (latest complete years).