Resin composition, prepreg, laminate, and printed wiring board
US-9902851-B2 · Feb 27, 2018 · US
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Patent family 50488367
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 50488367 |
| Family type | — |
| Earliest priority | Oct 19, 2012 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9902851B2 — Resin composition, prepreg, laminate, and printed wiring board |
Representative publication
Best representative member for this family based on priority and filing country.
US9902851B2 — Resin composition, prepreg, laminate, and printed wiring board (published Feb 27, 2018)
Member publications
Related publications in this family.
Resin composition, prepreg, laminate, and printed wiring board
US-2015267047-A1 · Sep 24, 2015 · US