Substrate treating apparatus and substrate treating method

Patent metadata

Field	Value
Publication number	US-9881827-B2
Application number	US-201514714225-A
Country	US
Kind code	B2
Filing date	May 15, 2015
Priority date	May 26, 2014
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a tape supply member configured to supply a tape to be attached to a substrate;
a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate;
a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate;
a temperature adjustment member configured to cool the tape disposed on a moving path of the tape that is supplied from the tape supply member to the support member; and
a drying module configured to dry the tape moving from the temperature adjustment member to the support member.

2. The substrate treating apparatus of claim 1 ,
wherein the temperature adjustment member comprises:
a housing having an inner space, an input hole through which the tape is taken into the inner space, and an output hole through which the tape is taken out of the inner space; and
a nozzle disposed in the housing to supply a temperature adjustment fluid into the inner space.

3. The substrate treating apparatus of claim 2 ,
wherein the nozzle is disposed in at least one of an upper portion of the inner space with respect to a moving path of the tape and a lower portion of the inner space with respect to the moving path of the tape.

4. The substrate treating apparatus of claim 2 ,
wherein the nozzle is disposed on a side surface of the housing.

5. The substrate treating apparatus of claim 2 ,
wherein the inner space has a width, which is perpendicular to a direction in which the tape is transferred, corresponding to that of the tape.

6. The substrate treating apparatus of claim 2 ,
wherein the temperature adjustment member further comprises at least one roller lengthwise disposed in a width direction of the tape.

7. The substrate treating apparatus of claim 6 ,
wherein the at least one roller comprises:
at least one front roller disposed adjacent to the input hole; and
at least one rear roller disposed adjacent to the output hole.

8. The substrate treating apparatus of claim 6 ,
wherein at least one of the at least one roller is configured to adjust the temperature of the tape.

9. The substrate treating apparatus of claim 1 ,
wherein the temperature adjustment member comprises:
at least one body, each body including at least one nozzle disposed on the body and configured to spray a temperature adjustment fluid.

10. The substrate treating apparatus of claim 9 ,
wherein the temperature adjustment member is disposed above a moving path of the tape or below the moving path of the tape.

11. The substrate treating apparatus of claim 9 ,
wherein the temperature adjustment member is disposed on an area overlapping the support member when viewed from above.

12. The substrate treating apparatus of claim 9 ,
wherein for each body, the at least one nozzle comprises a plurality of nozzles arranged on the body along a width direction of the tape.

13. The substrate treating apparatus of claim 1 ,
wherein the drying module comprises a spray member, a suction member and an air passage between the spray member and the suction member, and
wherein the air passage is in parallel to a bottom surface of the tape moving from the temperature adjustment member to the support member.

14. The substrate treating apparatus of claim 13 ,
wherein the spray member supplies a drying gas through the air passage toward the suction member, and
wherein the suction member receives the drying gas through the air passage.

15. The substrate treating apparatus of claim 14 , wherein
the suction member is disposed on an opposite side of the tape with respect to the spray member to receive the drying gas.

16. A substrate treating apparatus comprising:
a tape supply member configured to supply a tape to be attached to a substrate;
a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate;
a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate;
an adjustment member configured to adjust a state of the tape to a state where the tape undergoes contraction as time passes and positioned between the tape supply member and the support member; and
a drying module configured to dry the tape being in a contracted state by the adjustment member before the tape is attached to the substrate.

17. The substrate treating apparatus of claim 16 ,
wherein the adjustment member is configured to adjust a temperature of the tape.

18. The substrate treating apparatus of claim 16 ,
wherein the drying module comprises a spray member, a suction member and an air passage between the spray member and the suction member, and
wherein the air passage is in parallel to a bottom surface of the tape moving from the adjustment member to the support member.

19. The substrate treating apparatus of claim 18 ,
wherein the spray member supplies a drying gas through the air passage toward the suction member, and
wherein the suction member receives the drying gas through the air passage.

Assignees

• Kim Geunwoo
• Lee Seunghee
• Kim Hyun
• Kwon Ohchul
• An Sangho
• Oh Seonju
• Yoo Yun-Sik
• Samsung Electronics Co Ltd

Inventors

• Kim Geunwoo
• Lee Seunghee
• Kim Hyun
• Kwon Ohchul
• An Sangho
• Oh Seonju
• Yoo Yun-Sik

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/0434

  mainly by convection · CPC title