Electrochemical process for the preparation of lead foam

Patent metadata

Field	Value
Publication number	US-9863045-B2
Application number	US-201615080512-A
Country	US
Kind code	B2
Filing date	Mar 24, 2016
Priority date	Mar 24, 2015
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

The present invention provides a methodology of making lead foam by an electrochemical process in which non-conducting poly urethane foam was metalized using palladium chloride solution which was then coated with lead using the plating bath containing fluoboric acid, Lead as fluoborate solutions, boric acid and urea. The process was operated at a current density ranging from 0.5 A/dm 2 to 5 A/dm 2 , bath pH from 0.5 to 2.0, at temperature range from 30° C. to 50° C., followed with suitable post plating treatments. The surface morphology of the lead foam thus obtained was studied. The composition and purity of the lead foam was characterized with XRD. The porosity obtained depends upon the rate of deposition. The average value of the porosity realized in the range 86-79% with respect to time of deposition 2-6 h and the corresponding thickness of 45 to 60 micron.

First claim

We claim:

1. An electrochemical process for the preparation of lead foam comprising the steps:
(i) providing a polymer foam and coating a thin conductive layer over the surface of polymer foam,
(ii) coating copper over the conductive polymer foam as obtained in step (i) by electroless process to obtain copper coated polymer foam,
(iii) depositing lead over the copper coated polymer foam as obtained in step (ii) by electroplating process to obtain lead plated copper coated polymer foam,
(iv) removing the polymer foam and copper from the lead plated copper coated polymer foam as obtained in step (iii) by dipping it in organic solvent followed by sulphuric acid treatment to obtain lead foam.

2. The process of claim 1 , further comprising treating the lead foam at 180 to 210° C. for 1 to 3 hrs in reduced atmosphere.

3. An electrochemical process for preparation of lead foam comprising the steps:
(i) dipping a non-conducting polymer foam in palladium chloride solution having concentration 1:100 ratio by electroless process to obtain a thin conductive layer over the surface of polymer foam,
(ii) coating copper over a thin conductive layer over the surface of polymer foam as obtained in step (i) by electroless process using copper sulphate, paraformaldehyde, EDTA and gelatin at room temperature for 2 to 5 min to obtain copper coated polymer foam,
(iii) depositing lead over copper coated polymer foam as obtained in step (ii) by electroplating process wherein the lead plating bath contains 100-200 g/l fluoboric acid, 150-250 g/l Lead as fluoborate solutions, 20-30 g/l boric acid and 2-4 g/l urea at a current density in the range 0.5 to 5.0 A/dm 2 , bath pH ranging from 0.5 to 2 at temperature ranging from 30 to 50° C. for 2 to 6 hrs to obtain lead plated copper coated polymer foam,
(iv) removing polymer foam and copper from lead plated copper coated polymer foam as obtained in step (iii) by dipping it in organic solvent for time ranging from 2 to 5 min followed by sulphuric acid treatment for 1 to 5 min to obtain lead foam,
(v) removing oxygen present in the lead foam by heat treating the product as obtained in step (iv) at 180 to 210° C. for 1 to 3 hrs in reduced atmosphere.

4. An electrochemical process for the preparation of lead foam as claimed in claim 3 , wherein the polymer foam used is polyurethane foam of porosity in the range of 80% to 90%.

5. An electrochemical process for the preparation of lead foam as claimed in claim 3 , wherein the copper coating by electroless process is done by using concentration of 30 g/L copper sulphate, 10 g/L paraformaldehyde, 15 g/L EDTA and 0.5 g/L gelatin.

6. An electrochemical process for the preparation of lead foam as claimed in claim 3 , wherein the thickness of the lead coating obtained is 45-180 μm.

7. An electrochemical process for the preparation of lead foam as claimed in claim 3 , wherein the organic solvents used are preferably selected from acetone, N-methyl pyrrolidone and dimethyl formamide in the ratio 1:5:3 respectively.

8. An electrochemical process for the preparation of lead foam as claimed in claim 3 , wherein the reduced atmosphere generated is preferably selected from hydrogen:argon in the ratio 10:90 gas mixture.

Assignees

• Council Scient Ind Res

Inventors

• Dhananjeyan Manikka Venkatachalapthi Thulasiram
• JAGADESH Kopula Kesavan
• Babu Girinagasamy Kuppusamy Ramesh
• AMBALAVANAN Somasundaram
• SEKAR Ramachandran

Classifications

• C25D1/08

  Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title

• C25D3/34 Primary

  of lead · CPC title

• C23F1/18 Primary

  for etching copper or alloys thereof · CPC title

• C25D1/00

  Electroforming · CPC title

• C23C18/1648

  Porous product · CPC title