Growth of Nanowires
US-2024344223-A1 · Oct 17, 2024 · US
Electroforming
Electroforming · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D1/00 |
| Official title | Electroforming |
| Display label | Electroforming |
| Total patents | 326 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 24 |
| 2017 | 29 |
| 2018 | 23 |
| 2019 | 33 |
| 2020 | 31 |
| 2021 | 35 |
| 2022 | 38 |
| 2023 | 36 |
| 2024 | 30 |
| 2025 | 28 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electrochemical method for fabrication of high-purity, high-conductivity corrugated waveguides
US-2024030583-A1 · Jan 25, 2024 · US
Articles comprising thermally stable, grain-refined alloys
US-2024026556-A1 · Jan 25, 2024 · US
Systems and Methods for Forming Metal Matrix Composites
US-2017362727-A1 · Dec 21, 2017 · US
Mechanical component, mechanical component manufacturing method, movement, and timepiece
US-2017315509-A1 · Nov 2, 2017 · US
Microlattice damping material and method for repeatable energy absorption
US-2017307040-A1 · Oct 26, 2017 · US
Acid Mist Mitigation Agents for Electrolyte Solutions
US-2017283373-A1 · Oct 5, 2017 · US
Multi-layer encapsulated structures
US-9752247-B2 · Sep 5, 2017 · US
Deformable contact having a flat surface and a curved surface opposite the flat surface
US-9748049-B2 · Aug 29, 2017 · US
Flexible electrically conductive structure, flexible wiring board, production method thereof, and electronic device includng the same
US-2017241039-A1 · Aug 24, 2017 · US
Electrotype for forming an image during a paper making process
US-9739014-B2 · Aug 22, 2017 · US
Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
US-9728426-B2 · Aug 8, 2017 · US
Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
US-9714473-B2 · Jul 25, 2017 · US
Acid mist mitigation agents for electrolyte solutions
US-9714218-B2 · Jul 25, 2017 · US
High Strength, High Conductivity Electroformed Copper Alloys and Methods of Making
US-2017167007-A1 · Jun 15, 2017 · US
Mechanical component, mechanical component manufacturing method, movement, and timepiece
US-9678477-B2 · Jun 13, 2017 · US
Device having an electroformed pleated region and method of its manufacture
US-2017143936-A1 · May 25, 2017 · US
Method for fabrication of a metal component with at least one optical illusion design
US-2017130353-A1 · May 11, 2017 · US
Metal filter and method for concentrating cancer cells
US-2017128858-A1 · May 11, 2017 · US
Electroformed component production method
US-9598784-B2 · Mar 21, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D1/00?
- CPC C25D1/00 is the Cooperative Patent Classification code for “Electroforming.”
- How many patents are filed under CPC C25D1/00 (Electroforming)?
- Our database includes 326 publications tagged with this CPC code.
- Is patent activity under CPC C25D1/00 growing?
- Publication counts under this code: 30 in 2024 vs 28 in 2025 (latest complete years).