A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
for etching copper or alloys thereof
for etching copper or alloys thereof · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23F1/18 |
| Official title | for etching copper or alloys thereof |
| Display label | for etching copper or alloys thereof |
| Total patents | 288 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 42 |
| 2016 | 35 |
| 2017 | 24 |
| 2018 | 23 |
| 2019 | 23 |
| 2020 | 19 |
| 2021 | 35 |
| 2022 | 27 |
| 2023 | 20 |
| 2024 | 20 |
| 2025 | 15 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of improving lifetime of etching liquid and yield in Cu-interconnection process and Cu-interconnection etching device
US-9528188-B2 · Dec 27, 2016 · US
Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound
US-9504161-B2 · Nov 22, 2016 · US
Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing method
US-9466508-B2 · Oct 11, 2016 · US
Electrochemical process for the preparation of lead foam
US-2016281250-A1 · Sep 29, 2016 · US
Etch chemistries for metallization in electronic devices
US-9455283-B2 · Sep 27, 2016 · US
Wet etching methods for copper removal and planarization in semiconductor processing
US-9447505-B2 · Sep 20, 2016 · US
Aqueous composition for etching of copper and copper alloys
US-9441304-B2 · Sep 13, 2016 · US
Liquid compositions and methods of fabricating a semiconductor device using the same
US-9399822-B2 · Jul 26, 2016 · US
Etching liquid composition for multilayer containing copper and molybdenum and process for etching thereof
US-2016186057-A1 · Jun 30, 2016 · US
Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrate
US-9365934-B2 · Jun 14, 2016 · US
Copper foil for producing graphene and method of producing graphene using the same
US-9359212-B2 · Jun 7, 2016 · US
Etchant composition and method of forming metal wire and thin film transistor array panel using the same
US-9347125-B2 · May 24, 2016 · US
Method of treating wiring substrate and wiring substrate manufactured by the same
US-9301399-B2 · Mar 29, 2016 · US
Etchant composition and method of manufacturing metal wiring and thin film transistor substrate using the etchant
US-9293565-B2 · Mar 22, 2016 · US
Method for etching semiconductor structures and etching composition for use in such a method
US-9287228-B2 · Mar 15, 2016 · US
Etching liquid, etching method, and method of manufacturing solder bump
US-2016042993-A1 · Feb 11, 2016 · US
Etching of under bump metallization layer and resulting device
US-2016043046-A1 · Feb 11, 2016 · US
Method for etching semiconductor structures and etching composition for use in such a method
US-2015380370-A1 · Dec 31, 2015 · US
Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing method
US-2015380273-A1 · Dec 31, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23F1/18?
- CPC C23F1/18 is the Cooperative Patent Classification code for “for etching copper or alloys thereof.”
- How many patents are filed under CPC C23F1/18 (for etching copper or alloys thereof)?
- Our database includes 288 publications tagged with this CPC code.
- Is patent activity under CPC C23F1/18 growing?
- Publication counts under this code: 20 in 2024 vs 15 in 2025 (latest complete years).