Additives for electroplating baths

Patent metadata

Field	Value
Publication number	US-9783903-B2
Application number	US-201314098555-A
Country	US
Kind code	B2
Filing date	Dec 6, 2013
Priority date	Dec 6, 2013
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

Reaction products of halogenated pyrimidines and nucleophilic linker units are included in metal electroplating baths to provide good throwing power. The electroplating baths can be used to plate metal, such as copper, tin and alloys thereof on printed circuit boards and semiconductors and fill through-holes and vias.

First claim

What is claimed is:

1. A metal electroplating composition comprising: one or more sources of metal ions chosen from copper salts and tin salts, and one or more compounds of a reaction product of one or more compounds having formula:

wherein R 1 , R 2 , R 3 and R 4 are the same or different and are hydrogen, or halogen, or linear or branched, substituted or unsubstituted (C 1 -C 10 )alkyl, or —NR 5 R 6 wherein R 5 and R 6 are the same or different and are hydrogen, or linear or branched, substituted or unsubstituted (C 1 -C 10 ) alkyl, or (C 1 -C 10 )alkoxy, or mercaptan, or mercapto(C 1 -C 10 )alkyl, or —NO 2 , or —NO, or nitro(C 1 -C 10 )alkyl, or R 3 and R 4 can be taken together with all of their carbon atoms to form a substituted or unsubstituted aryl, and with the proviso that at least one of R 1 , R 2 , R 3 and R 4 is a halogen; and one or more compounds having formula:
Y 1 —R—Y 2   (II)

wherein Y 1 and Y 2 are the same or different and are chosen from hydrogen, —NH 2 , —SH, or —OH,
R is a moiety having formula:

and wherein Z 1 and Z 2 of moiety (V) may be the same or different and are chosen from:

wherein D is substituted or unsubstituted (C 5 -C 12 )cycloalkyl or (C 5 -C 12 )aryl, R′ of moiety (V) is a moiety having formula:

wherein R 7 through R 10 are the same or different and are chosen from hydrogen, or linear or branched (C 1 -C 5 )alkyl, or linear or branched amino(C 1 -C 5 )alkyl, or hydroxyl, or linear or branched hydroxy(C 1 -C 5 )alkyl; R′ 1 through R′ 7 are the same or different and are chosen from hydrogen, or linear or branched (C 1 -C 5 )alkyl, or hydroxyl, or linear or branched hydroxy(C 1 -C 5 ) alkyl, or linear or branched amino(C 1 -C 5 )alkyl; R′ 8 and R′ 9 are the same or different and are chosen from hydrogen, or linear or branched (C 1 -C 5 )alkyl, or hydroxyl, or hydroxy(C 1 -C 5 ) alkyl, or a moiety having formula:

wherein R′ 10 through R′ 15 are the same or different and are chosen from hydrogen, or linear or branched (C 1 -C 5 )alkyl; Y 3 is —NH 2 , —SH or —OH; a, b, e and n are integers of 1 to 20 and r is 1 to 10.

2. The metal electroplating composition of claim 1 , further comprising one or more accelerators.

3. A method comprising:
a) contacting a substrate to be metal plated with the metal electroplating composition of claim 1 ;
b) applying a current; and
c) electroplating metal on the substrate.

4. The method of claim 3 , wherein the substrate comprises a plurality of through-holes and vias.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Kozhukh Julia
• Niazimbetova Zuhra I
• Rzeznik Maria Anna

Classifications

• C25D3/38

  of copper · CPC title

• H05K3/423

  characterised by electroplating method · CPC title

• C25D3/58

  containing more than 50% by weight of copper · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title