Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US-10625393-B2 · Apr 21, 2020 · US
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Kozhukh Julia patents
Kozhukh Julia is listed as an inventor on 44 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kozhukh Julia |
| Total patents | 44 |
| First publication | May 21, 2015 |
| Latest publication | Apr 21, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them
US-10316218-B2 · Jun 11, 2019 · US
Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them
US-10221336-B2 · Mar 5, 2019 · US
Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them
US-2019062593-A1 · Feb 28, 2019 · US
Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens
US-10190226-B2 · Jan 29, 2019 · US
Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them
US-2018362805-A1 · Dec 20, 2018 · US
Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US-2018354094-A1 · Dec 13, 2018 · US
Method of making polishing layer for chemical mechanical polishing pad
US-10144115-B2 · Dec 4, 2018 · US
Method of making polishing layer for chemical mechanical polishing pad
US-10105825-B2 · Oct 23, 2018 · US
Method of making composite polishing layer for chemical mechanical polishing pad
US-10092998-B2 · Oct 9, 2018 · US
Recent patents
Latest publications not already listed above.
Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films
US-10037889-B1 · Jul 31, 2018 · US
Method of making composite polishing layer for chemical mechanical polishing pad
US-10011002-B2 · Jul 3, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US-10006136-B2 · Jun 26, 2018 · US
Additives for electroplating baths
US-9783903-B2 · Oct 10, 2017 · US
Chemical mechanical polishing pad and method of making same
US-9776300-B2 · Oct 3, 2017 · US
Electroless metallization of dielectrics with alkaline stable pyrimidine derivative containing catalysts
US-2017175272-A9 · Jun 22, 2017 · US
Chemical mechanical polishing pad composite polishing layer formulation
US-9630293-B2 · Apr 25, 2017 · US
Chemical mechanical polishing pad and method of making same
US-9586305-B2 · Mar 7, 2017 · US
Electroless metallization of dielectrics with alkaline stable pyrimidine derivative containing catalysts
US-2017044671-A1 · Feb 16, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US-2017037528-A1 · Feb 9, 2017 · US
Composite polishing layer chemical mechanical polishing pad
US-9539694-B1 · Jan 10, 2017 · US
Composite polishing layer chemical mechanical polishing pad
US-2016375544-A1 · Dec 29, 2016 · US
Chemical mechanical polishing pad and method of making same
US-2016375543-A1 · Dec 29, 2016 · US
Chemical mechanical polishing pad and method of making same
US-2016379840-A1 · Dec 29, 2016 · US
Method of making composite polishing layer for chemical mechanical polishing pad
US-2016375554-A1 · Dec 29, 2016 · US
Method of making polishing layer for chemical mechanical polishing pad
US-2016375553-A1 · Dec 29, 2016 · US
Method of making polishing layer for chemical mechanical polishing pad
US-2016375555-A1 · Dec 29, 2016 · US
Chemical mechanical polishing pad composite polishing layer formulation
US-2016375545-A1 · Dec 29, 2016 · US
Method of making composite polishing layer for chemical mechanical polishing pad
US-2016375552-A1 · Dec 29, 2016 · US
Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines
US-9518324-B2 · Dec 13, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Rohm & Haas Elect Materials Cmp Holdings Inc | 25 |
| Rohm & Haas Elect Mat | 20 |
| Dow Global Technologies Llc | 16 |
| Rohm And Haas Elecironic Mat Llc | 2 |
| Rohm And Hass Electronic Mat Cmp Holdings Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B24B37/24 | 17 |
| H10P52/402 | 16 |
| C25D3/38 | 14 |
| C25D7/123 | 14 |
| H10P52/403 | 13 |