Methods of forming semiconductor devices
US-2024387699-A1 · Nov 21, 2024 · US
US9741559B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9741559-B2 |
| Application number | US-201414764687-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 23, 2014 |
| Priority date | Feb 22, 2013 |
| Publication date | Aug 22, 2017 |
| Grant date | Aug 22, 2017 |
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The present invention is to form an organic film on a substrate having a pattern formed on a front surface thereof and configured to: apply an organic material onto the substrate; then thermally treat the organic material to form an organic film on the substrate; and then perform ultraviolet irradiation processing on the organic film to remove a surface of the organic film down to a predetermined depth, thereby appropriately and efficiently form the organic film on the substrate.
Opening claim text (preview).
What is claimed: 1. A film forming method of forming an organic film on a substrate having a pattern formed on a front surface thereof, the method comprising: a coating treatment step of applying an organic material onto the substrate; a thermal treatment step of then thermally treating the organic material to form an organic film on the substrate; and an ultraviolet irradiation step of then performing ultraviolet irradiation processing on the organic film to remove a surface of the organic film down until a surface of the pattern is exposed, wherein the coating treatment step is performed again after the coating treatment step, the thermal treatment step, and the ultraviolet irradiation step are performed. 2. The film forming method according to claim 1 , wherein at the ultraviolet irradiation step, the ultraviolet irradiation processing is performed while the organic film is being heated. 3. The film forming method according to claim 2 , wherein the thermal treatment at the ultraviolet irradiation step is performed by mounting the substrate on a thermal treatment plate. 4. The film forming method according to claim 3 , wherein a plurality of the thermal treatment plates are provided and perform the thermal treatment at the ultraviolet irradiation step at different temperatures respectively. 5. The film forming method according to claim 2 , wherein the thermal treatment at the ultraviolet irradiation step is performed by irradiating light from a light source. 6. The film forming method according to claim 1 , wherein at the ultraviolet irradiation step, at least an oxygen concentration of a treatment atmosphere, an illuminance of ultraviolet rays, or an irradiation time of the ultraviolet rays is controlled. 7. The film forming method according to claim 1 , further comprising: a film thickness measurement step of measuring a film thickness of the organic film after the ultraviolet irradiation step, wherein a treatment condition of the ultraviolet irradiation step is corrected based on a measurement result at the film thickness measurement step. 8. A computer-readable storage medium storing a program running on a computer of a control unit controlling a film forming system to cause the film forming system to perform a film forming method of forming an organic film on a substrate having a pattern formed on a front surface thereof, the film forming method comprising: a coating treatment step of applying an organic material onto the substrate; a thermal treatment step of then thermally treating the organic material to form an organic film on the substrate; and an ultraviolet irradiation step of then performing ultraviolet irradiation processing on the organic film to remove a surface of the organic film down until a surface of the pattern is exposed, wherein the coating treatment step is performed again after the coating treatment step, the thermal treatment step, and the ultraviolet irradiation step are performed. 9. A film forming system for forming an organic film on a substrate having a pattern formed on a front surface thereof, the system comprising: a coating treatment unit that applies an organic material onto the substrate; a thermal treatment unit that thermally treats the organic material to form an organic film on the substrate; an ultraviolet irradiation unit that performs ultraviolet irradiation processing on the organic film; and a control unit that controls the coating treatment unit, the thermal treatment unit, and the ultraviolet irradiation unit to perform the coating treatment, the thermal treatment, and the ultraviolet irradiation processing in this order and remove a surface of the organic film down until a surface of the pattern is exposed in the ultraviolet irradiation processing, wherein the control unit controls the coating treatment unit, the thermal treatment unit, and the ultraviolet irradiation unit to perform the coating treatment again after performing the coating treatment, the thermal treatment, and the ultraviolet irradiation processing. 10. The film forming system according to claim 9 , further comprising: another thermal treatment unit that thermally treats the organic film when the ultraviolet irradiation processing is performed. 11. The film forming system according to claim 10 , wherein the another thermal treatment unit has a thermal treatment plate that mounts and thermally treats the substrate thereon. 12. The film forming system according to claim 11 , wherein a plurality of the thermal treatment plates are provided and perform the thermal treatment at different temperatures respectively. 13. The film forming system according to claim 10 , wherein the another thermal treatment unit has a light source that radiates irradiating light to the organic film. 14. The film forming system according to claim 9 , wherein the thermal treatment unit and the ultraviolet irradiation unit are provided in a same apparatus, and wherein in the apparatus, a heat insulating material that is movable between the thermal treatment unit and the ultraviolet irradiation unit and holds the substrate and keeps the substrate warm. 15. The film forming system according to claim 9 , wherein the control unit controls at least an oxygen concentration of a treatment atmosphere, an illuminance of ultraviolet rays, or an irradiation time of the ultraviolet rays in the ultraviolet irradiation processing. 16. The film forming system according to claim 9 , further comprising: a film thickness measurement unit that measures a film thickness of the organic film after the ultraviolet irradiation processing is performed, wherein the control unit corrects a treatment condition of the ultraviolet irradiation processing, based on a measurement result by the film thickness measurement unit.
Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title
carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title
the removal being chemical etching · CPC title
of masks comprising organic materials · CPC title
comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title
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