Substrate tuning system and method using optical projection

Patent metadata

Field	Value
Publication number	US-9735067-B2
Application number	US-201414554382-A
Country	US
Kind code	B2
Filing date	Nov 26, 2014
Priority date	Nov 27, 2013
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

Techniques herein include systems and methods that provide a spatially-controlled or pixel-based projection of light onto a substrate to tune various substrate properties. A given pixel-based image projected on to a substrate surface can be based on a substrate signature. The substrate signature can spatially represent non-uniformities across the surface of the substrate. Such non-uniformities can include energy, heat, critical dimensions, photolithographic exposure dosages, etc. Such pixel-based light projection can be used to tune various properties of substrates, including tuning of critical dimensions, heating uniformity, evaporative cooling, and generation of photo-sensitive agents. Combining such pixel-based light projection with photolithographic patterning processes and/or heating processes improves processing uniformity and decreases defectivity. Embodiments can include using a digital light processing (DLP) chip, grating light valve (GLV), or other grid-based micro projection technology.

First claim

The invention claimed is:

1. A processing system for treating substrates, the processing system comprising:
a chamber sized and configured to receive a substrate for processing, wherein the chamber is positioned within a semiconductor fabrication tool that includes at least one module that dispenses liquid on a spinning substrate, and includes at least one module with a heating mechanism for heating a substrate;
a substrate holder positioned within the chamber and configured to hold the substrate;
an image projection system configured to project an image onto an upper surface of the substrate when the substrate is in the chamber, the image projection system using a micro-mirror projection device to project the image; and
a controller configured to control the image projection system and cause the image projection system to project a pixel-based image onto the upper surface of the substrate based on a predetermined substrate signature.

2. The processing system of claim 1 , wherein the image projection system includes a light source.

3. The processing system of claim 1 , wherein the predetermined substrate signature identifies one signature selected from the group consisting of a substrate heat signature, a critical dimension signature, and a lithographic exposure signature.

4. The processing system of claim 3 , wherein each projected pixel can be varied by a parameter selected from the group consisting of light intensity, light frequency, and light amplitude.

5. The processing system of claim 3 , wherein the chamber is positioned within a semiconductor fabrication tool that includes at least one module that dispenses liquid on a spinning substrate, and includes at least one module with a heating mechanism for heating a substrate.

6. The processing system of claim 5 , further comprising:
a thermal imaging system positioned in view of the upper surface of the substrate and configured to capture a pixel-based heat signature of the substrate.

7. The processing system of claim 1 , wherein the image projection system uses a digital light processing (DLP) device or grating light valve (GLV) device to project the image onto the upper surface of the substrate.

8. The processing system of claim 1 , further comprising a dispense system configured to dispense liquid compositions on the surface of the substrate.

9. The processing system of claim 1 , wherein the chamber is positioned within a semiconductor fabrication tool that includes:
at least one module configured to dispense photoresist on a substrate;
at least one module configured to dispense developing chemicals on a substrate; and
at least one module configured to bake a substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Devilliers Anton J
• Fulford Daniel
• Leusink Gerrit J

Classifications

• H10P76/00

  Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P74/23 Primary

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• G03F7/168 Primary

  Finishing the coated layer, e.g. drying, baking, soaking · CPC title