Apparatus for separating wafer from carrier

Patent metadata

Field	Value
Publication number	US-9735039-B2
Application number	US-201414465185-A
Country	US
Kind code	B2
Filing date	Aug 21, 2014
Priority date	Mar 22, 2012
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

First claim

What is claimed is:

1. An apparatus, comprising:
a platform having an upper surface;
a tape feeding unit;
a first robot arm; and
a controller coupled to the platform, the tape feeding unit, and the first robot arm, the controller being configured to:
mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform, the wafer assembly including the wafer, a carrier, and a layer of wax between the wafer and the carrier;
heat the upper surface of the platform to a predetermined temperature;
separate the wafer and the wafer frame mounted thereon from the carrier by simultaneously:
controlling the platform to secure the carrier on the upper surface of the platform,
driving the first robot arm to lift the wafer and the wafer frame, and
continuing to heat the upper surface of the platform at a temperature equal to or greater than the predetermined temperature.

2. The apparatus of claim 1 , further comprising:
a second robot arm coupled to the controller, the second robot arm being configured to obtain the wafer assembly from outside the apparatus and to place the wafer assembly on the upper surface of the platform.

3. The apparatus of claim 2 , further comprising:
an alignment sensor coupled to the controller,
the controller being further configured to detect a wafer orientation of the wafer assembly by the alignment sensor and position the wafer assembly on the upper surface of the platform by the second robot arm according to the detected wafer orientation.

4. The apparatus of claim 1 , wherein the platform is rotatable, and the controller is further configured to cause the platform to rotate during a period that the first robot arm is driven to separate the wafer and the wafer frame mounted thereon from the carrier.

5. The apparatus of claim 1 , wherein the platform is a chuck table configured to secure the carrier on the upper surface of the platform.

6. The apparatus of claim 1 , wherein the controller is further configured to control the platform to rotate at a predetermined rotational speed.

7. The apparatus of claim 1 , wherein the controller is further configured to drive the first robot arm to lift the wafer and the wafer frame at a predetermined speed.

8. The apparatus of claim 1 , wherein the controller is further configured to move, by the first robot arm, the wafer frame to the upper surface of the platform.

9. The apparatus of claim 1 , further comprising:
an alignment sensor coupled to the controller,
the controller being further configured to detect a wafer orientation of the wafer assembly by the alignment sensor and position the wafer assembly on the upper surface of the platform by the first robot arm according to the detected wafer orientation.

10. The apparatus of claim 1 , wherein the controller is further configured to drive the platform to a position under the tape feeding unit.

11. The apparatus of claim 1 , wherein the controller is further configured to drive the tape feeding unit to a position above the platform.

12. The apparatus of claim 1 , wherein the predetermined temperature ranges from 100° C. to 120° C.

13. An apparatus, comprising:
a platform having an upper surface;
a tape feeding unit;
a first robot arm; and
a controller coupled to the platform, the tape feeding unit, and the first robot arm, the controller being configured to:
secure a carrier on the upper surface of the platform, the carrier being bonded to a wafer by a layer of wax between the wafer and the carrier;
bind the wafer to a wafer frame using tape from the tape feeding unit;
heat the wafer, carrier, and layer of wax to a predetermined temperature of at least 100° C.; and
separate the wafer and the wafer frame from the carrier by simultaneously:
controlling the platform to continue to secure the carrier on the upper surface of the platform,
driving the first robot arm to lift the wafer and the wafer frame, and
continuing to heat the upper surface of the platform at a temperature equal to or greater than the predetermined temperature.

14. The apparatus of claim 13 , wherein the platform comprises a heater.

15. The apparatus of claim 13 , wherein the platform is a chuck table configured to secure the carrier on the upper surface of the platform by a vacuum device.

16. The apparatus of claim 13 , wherein the platform is a chuck table configured to secure the carrier on the upper surface of the platform by an electrostatic device.

17. The apparatus of claim 13 , wherein the platform is configured to be driven by the controller to a position under the tape feeding unit.

18. The apparatus of claim 13 , wherein the tape feeding unit is configured to be driven by the controller to a position above the platform.

19. An apparatus, comprising:
a platform having an upper surface;
a tape feeding unit;
a first robot arm;
a second robot arm; and
a controller coupled to the platform, the tape feeding unit, the first robot arm, and the second robot arm, the controller being configured to:
place, using the second robot arm, a wafer assembly on the upper surface of the platform, the wafer assembly including a wafer, a carrier, and a layer of wax between the wafer and the carrier;
mount a wafer frame, using the tape feeding unit, to the wafer;
heat the upper surface of the platform to a predetermined temperature;
separate the wafer and the wafer frame mounted thereon from the carrier by simultaneously:
controlling the platform to secure the carrier on the upper surface of the platform,
driving the first robot arm to lift the wafer and the wafer frame, and
continuing to heat the upper surface of the platform at a temperature equal to or greater than the predetermined temperature.

20. The apparatus of claim 19 , further comprising:
an alignment sensor coupled to the controller,
the controller being further configured to detect a wafer orientation of the wafer assembly by the alignment sensor and position the wafer assembly on the upper surface of the platform by the second robot arm according to the detected wafer orientation.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hwang Chien Ling
• Wang Lin-Wei
• Liu Chung-Shi

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/0434

  mainly by convection · CPC title