Composition for metal electroplating comprising leveling agent

Patent metadata

Field	Value
Publication number	US-9683302-B2
Application number	US-201113701217-A
Country	US
Kind code	B2
Filing date	May 31, 2011
Priority date	Jun 1, 2010
Publication date	Jun 20, 2017
Grant date	Jun 20, 2017

Abstract

A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R 1 , R 2 , R 3 are each independently selected from an H atom and an organic radical having from 1 to 20 carbon atoms, R4 is a divalent, trivalent or mutlivalent organic radical which does not comprise a hydroxyl group in the a or β position relative to the nitrogen atom of the imidazole rings is an integer.

First claim

The invention claimed is:

1. A composition, comprising:
a source of metal ions, wherein the metal ions comprise copper ions;
an additive comprising a linear or branched, polymeric imidazolium compound comprising a structural unit of the formula L1:

wherein:
R 1 , R 2 , R 3 are each independently selected from the group consisting of an H atom and an organic radical comprising from 1 to 20 carbon atoms,
R 4 is a divalent, trivalent or multivalent organic radical which does not comprise a hydroxyl group in an α or a β position relative to the nitrogen atom of an imidazole ring connected to R 4 , and
n is an integer from 2 to 6,000;

water, and
an acid in a concentration of from 1 to 300 g/l,
wherein the composition is acidic.

2. The composition according to claim 1 , wherein R 1 and R 2 are H atoms.

3. The composition according to claim 1 , wherein R 3 is an H atom.

4. The composition according claim 1 , wherein R 4 is a substituted or an unsubstituted C2 to C20 alkandiyl.

5. The composition according to claim 4 , wherein R 4 does not comprise hydroxyl groups.

6. The composition according claim 1 , wherein the additive comprises a counterion Y o− , wherein o is an integer from 1 to 4.

7. The composition according to claim 6 , wherein the counterion Y o− is a chloride, a sulfate or an acetate.

8. The composition according to claim 1 , wherein a number average molecular weight M n of the polymeric imidazolium compound, determined by gel permeation chromatography, is greater than 500 g/mol.

9. The composition according to claim 1 , wherein the polymeric imidazolium compound comprises more than 80% by weight of structural units of the formula L1.

10. The composition according to claim 1 , wherein the additive is prepared by reacting
an α-dicarbonyl compound R 1 —CO—CO—R 2 ,
an aldehyde R 3 —CHO,
at least one amino compound (NH 2 —) m R 4 , wherein m is an integer greater than or equal to 2 and
a protic acid (H + ) o Y o− , wherein Y o− is an anion of the protonic acid and o is an integer.

11. The composition according to claim 10 , wherein the amino compound is an aliphatic or aromatic diamine, triamine, multiamine, or mixtures thereof.

12. The composition according to claim 1 , further comprising an accelerating agent.

13. The composition according to claim 1 , further comprising a suppressing agent.

14. The composition according to claim 1 , wherein an amount of the polymeric imidazolium compound in the composition is from 0.1 to 1000 ppm.

15. A process, comprising:
a) contacting a metal plating bath comprising the composition according to claim 1 with a substrate, and
b) applying a current density to the substrate for a time sufficient to deposit a metal layer onto the substrate.

16. The process according to claim 15 , wherein the substrate comprises micrometer or submicrometer sized features, and the metal layer is deposited to fill the micrometer or submicrometer sized features.

17. The process according to claim 16 , wherein the micrometer or submicrometer sized features have a size of from 1 to 1000 nm, an aspect ratio of 4 or more, or both.

18. A method of producing a metal containing layers, the method comprising:
electrodepositing metal containing layers in a bath comprising copper ions and water in the presence of an additive comprising a linear or branched, polymeric imidazolium compound comprising a structural unit of the formula L1:

wherein:
R 1 , R 2 , R 3 are each independently selected from the group consisting of an H atom and an organic radical comprising from 1 to 20 carbon atoms,
R 4 is a divalent, trivalent or multivalent organic radical which does not comprise a hydroxyl group in an α or a β position relative to the nitrogen atom of an imidazole ring connected to R 4 , and
n is an integer from 2 to 6,000, and

an acid in a concentration of from 1 to 300 g/l,
wherein the bath is acidic.

19. The method according to claim 18 , wherein an amount of the polymeric imidazolium compound in the bath is from 0.1 to 1000 ppm.

Assignees

• Siemer Michael
• Roeger-Goepfert Cornelia
• Meier Nicole
• Raether Roman Benedikt
• Arnold Marco
• Emnet Charlotte
• Mayer Dieter
• Fluegel Alexander
• Basf Se

Inventors

• Siemer Michael
• Roeger-Goepfert Cornelia
• Meier Nicole
• Raether Roman Benedikt
• Arnold Marco
• Emnet Charlotte
• Mayer Dieter
• Fluegel Alexander

Classifications

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C08L79/04 Primary

  Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors · CPC title

• C25D3/02

  from solutions (C25D5/34 - C25D5/46 take precedence) · CPC title

• C25D3/58

  containing more than 50% by weight of copper · CPC title

• C08G73/0616 Primary

  with only two nitrogen atoms in the ring · CPC title