Methods for solder for through-mold interconnect

Patent metadata

Field	Value
Publication number	US-9666549-B2
Application number	US-201514879418-A
Country	US
Kind code	B2
Filing date	Oct 9, 2015
Priority date	Sep 25, 2013
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

Generally discussed herein are systems and apparatuses that include an extended TSBA ball and techniques for making the same. According to an example, a technique can include forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is for coupling the circuit with a die along a lower surface of the circuit substrate. A molding can be formed onto an upper surface of the circuit substrate, over the circuit of the circuit substrate. An opening can be defined in the molding so that the opening can extend to a top surface of the molding to at least a portion of the circuit. Solder can be formed into the opening, including conforming the solder to the opening and the circuit substrate.

First claim

What is claimed is:

1. A method of forming a microelectronic package, comprising:
forming a first circuit substrate including forming a first circuit on a first substrate, the first circuit exposed along an upper surface of the first substrate, wherein the first substrate is configured for coupling the first circuit with an integrated circuit above an upper surface of the first circuit substrate;
forming a mold onto an upper surface of the first circuit substrate over and on the first circuit of the first circuit substrate;
defining an opening in the mold, the opening extending from a top surface of the mold to at least a portion of the first circuit to expose the portion of the first circuit;
situating a first solder in the opening, including conforming the first solder to the opening and the portion of the first circuit;
extending a height of the first solder in the opening to create an extended first solder;
situating the integrated circuit on the mold and aligning a second solder on the integrated circuit with the opening in the mold;
reflowing the extended first solder and the second solder to form an electrical connection between the extended first solder and the second solder;
wherein situating the first solder in the opening includes at least one of printing the first solder into the opening and melting at least one first solder ball into the opening; and
wherein extending the height of the first solder includes at least one of printing a second solder into the opening and onto the first solder and melting at least one second solder ball into the opening and onto the first solder.

2. The method of claim 1 , wherein extending the height of the first solder includes melting the one or more second solder balls in the opening and onto the first solder.

3. The method of claim 1 , wherein the first circuit substrate includes a solder-resistant mask, and the first solder fills an opening in the solder-resistant mask and is printed to extend above the solder-resistant mask.

4. The method of claim 1 , wherein the first circuit substrate includes a solder-resistant mask, and the first solder fills an opening in the solder-resistant mask and is substantially flush with the solder-resistant mask.

5. The method of claim 1 , further comprising situating flux on the first solder and on the at least one second solder ball and then melting the at least one second solder ball.

6. The method of claim 5 , wherein situating flux on the first solder includes printing the flux using an inkjet printing device.

7. The method of claim 1 , wherein situating the first solder includes printing the first solder onto the circuit substrate and defining the opening includes excising the mold to define the opening.

8. The method of claim 1 , wherein the first solder is generally cylindrical in shape.

9. The method of claim 8 , wherein the extended first solder includes a generally frustoconical shape solder portion on the first solder.

10. The method of claim 9 , wherein the frustoconical shape solder portion is coextensive with the first solder portion and the frustoconical shape opens away from the cylindrical portion.

11. A method of forming a microelectronic package, comprising:
forming a circuit substrate including forming a circuit on a substrate, the circuit exposed along an upper surface of the substrate, wherein the substrate is configured for coupling the circuit with an integrated circuit above an upper surface of the circuit substrate;
situating a solder column on the circuit of the circuit substrate;
forming a mold onto an upper surface of the circuit substrate over and on the circuit of the circuit substrate and over and on the solder column;
defining an opening in the mold, the opening extending from a top surface of the mold to expose the solder column;
extending a height of the solder column in the opening to create an extended solder column;
situating the integrated circuit on the molding and aligning second solder on the integrated circuit with the opening in the mold; and
reflowing the extended solder column and the second solder to form an electrical connection between the extended solder column and the second solder;
wherein the solder column is coextensive with a top surface of a solder resistant mask on a surface of the substrate, and wherein extending the height of the solder column includes inkjet printing third solder on the solder column in the opening.

12. The method of claim 11 , wherein situating the solder column includes printing the solder column using an inkjet printing device.

13. The method of claim 11 , further comprising situating flux on the circuit before situating the solder column on the circuit.

14. The method of claim 13 , wherein situating the flux includes printing the flux on the circuit using an inkjet printing device.

15. The method of claim 11 , wherein the solder column extends beyond a top surface of a solder resistant mask on a surface of the substrate, and wherein extending the height of the solder column includes situating one or more solder balls in the opening and melting the one or more solder balls on the solder column.

16. The method of claim 15 , further comprising situating flux on the solder column and the one or more solder balls before melting the one or more solder balls.

Assignees

• Intel Corp

Inventors

• Chiu Chia-Pin
• Xiong Xiaorong
• Zhang Linda
• Nickerson Robert
• Gealer Charles

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/721

  of bump connectors · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title