Localized high density substrate routing

Patent metadata

Field	Value
Publication number	US-9136236-B2
Application number	US-201213630297-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Sep 28, 2012
Publication date	Sep 15, 2015
Grant date	Sep 15, 2015

Abstract

Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.

First claim

What is claimed is:

1. An apparatus comprising:
a medium including low density interconnect routing therein;
a first circuitry element and a second circuitry element;
an interconnect element, the interconnect element embedded in the medium, the interconnect element including high density routing therein, the interconnect element including a plurality of electrically conductive members, an electrically conductive member of the plurality of electrically conductive members electr…

Assignees

• Starkston Robert
• Mallik Debendra
• Guzek John S
• Chiu Chia-Pin
• Kulkarni Deepak
• Mahajan Ravi V
• Intel Corp

Inventors

• Starkston Robert
• Mallik Debendra
• Guzek John S
• Chiu Chia-Pin
• Kulkarni Deepak
• Mahajan Ravi V

Classifications

• H10W70/618

  Electricity · mapped topic

• H10W70/63

  Electricity · mapped topic

• H10W72/926

  Electricity · mapped topic

• H10W72/9415

  Electricity · mapped topic

• H10W72/29

  Electricity · mapped topic