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with the help of an intermediate layer (contacts provided with a solder layer H01H1/0231)

with the help of an intermediate layer (contacts provided with a solder layer H01H1/0231) · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01H11/045
Official title{with the help of an intermediate layer (contacts provided with a solder layer H01H1/0231)}
Display labelwith the help of an intermediate layer (contacts provided with a solder layer H01H1/0231)
Total patents12

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
YearPatents
20152
20162
20173
20181
20192
20231
20251

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.