Braze materials and earth-boring tools comprising braze materials
US-10160063-B2 · Dec 25, 2018 · US
with copper as the next major constituent
with copper as the next major constituent · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C5/08 |
| Official title | with copper as the next major constituent |
| Display label | with copper as the next major constituent |
| Total patents | 135 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 15 |
| 2017 | 20 |
| 2018 | 14 |
| 2019 | 13 |
| 2020 | 12 |
| 2021 | 12 |
| 2022 | 13 |
| 2023 | 4 |
| 2024 | 10 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electroluminescence device and display device
US-2018294430-A1 · Oct 11, 2018 · US
Circuit substrate, and electronic device including same
US-2018247878-A1 · Aug 30, 2018 · US
Sliding contact point material and method for manufacturing same
US-2018223394-A1 · Aug 9, 2018 · US
Seal ring and method for manufacturing seal ring
US-2018213668-A1 · Jul 26, 2018 · US
Electroluminescence device and display device
US-10020460-B2 · Jul 10, 2018 · US
Metal joining structure using metal nanoparticles and metal joining method and metal joining material
US-9960140-B2 · May 1, 2018 · US
Seal ring and method for manufacturing seal ring
US-9961791-B2 · May 1, 2018 · US
Method for manufacturing sintered bearing, and sintered bearing
US-2018112712-A1 · Apr 26, 2018 · US
Liquid dispersion of metal nanoparticles for solder paste, method for producing the liquid dispersion, solder paste, method for producing the solder paste
US-2018056448-A1 · Mar 1, 2018 · US
Binary ag-cu amorphous thin-films for electronic applications
US-2018044782-A1 · Feb 15, 2018 · US
Solid metal alloy
US-2017369969-A1 · Dec 28, 2017 · US
High quality, void and inclusion free alloy wire
US-2017320172-A1 · Nov 9, 2017 · US
Bonding wire for semiconductor devices
US-9812421-B2 · Nov 7, 2017 · US
Braze materials and earth-boring tools comprising braze materials
US-2017304959-A1 · Oct 26, 2017 · US
Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
US-9780011-B2 · Oct 3, 2017 · US
Ag ALLOY SPUTTERING TARGET, METHOD OF MANUFACTURING Ag ALLOY SPUTTERING TARGET, Ag ALLOY FILM, AND METHOD OF FORMING Ag ALLOY FILM
US-2017233863-A1 · Aug 17, 2017 · US
Methods and compositions for brazing
US-9731384-B2 · Aug 15, 2017 · US
Solid metal alloy
US-9732401-B2 · Aug 15, 2017 · US
Organic electroluminescence device and method of manufacturing the same
US-9722201-B2 · Aug 1, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C22C5/08?
- CPC C22C5/08 is the Cooperative Patent Classification code for “with copper as the next major constituent.”
- How many patents are filed under CPC C22C5/08 (with copper as the next major constituent)?
- Our database includes 135 publications tagged with this CPC code.
- Is patent activity under CPC C22C5/08 growing?
- Publication counts under this code: 10 in 2024 vs 8 in 2025 (latest complete years).