Chip component

Patent metadata

Field	Value
Publication number	US-9646747-B2
Application number	US-201214373900-A
Country	US
Kind code	B2
Filing date	Dec 26, 2012
Priority date	Jan 27, 2012
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

First claim

What is claimed is:

1. A chip resistor comprising:
a substrate;
an element circuit network including a plurality of element parts formed on the substrate, the element circuit network including a resistor network having a plurality of resistor bodies formed on the substrate, the resistor bodies each including a resistor body film formed on the substrate, wherein a wiring film is laminated on the resistor body film;
an external connection electrode provided on one of two main surfaces of the substrate to provide external connection for the element circuit network;
a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode;
a solder layer formed on an external connection terminal of the external connection electrode; and
a resin film, which covers the one of the two main surfaces of the substrate and a side surface of the substrate.

2. The chip resistor according to claim 1 , wherein the wiring film and the fuses are conductor films formed at the same layer and the conductor films are also provided on the substrate at which the external connection electrode is provided.

3. The chip resistor according to claim 2 , wherein the external connection electrode is formed from a conductor material laminated on a conductor film forming a portion of the element circuit network.

4. The chip resistor according to claim 3 , wherein the conductor material includes a conductor material film with a multilayer structure.

5. The chip resistor according to claim 2 , wherein the external connection electrode includes a nickel layer, a palladium layer, a gold layer, and a solder layer.

6. The chip resistor according to claim 2 , wherein the external connection electrode includes a copper layer and a solder layer.

Assignees

• Rohm Co Ltd

Inventors

• Tamagawa Hiroshi
• Yamamoto Hiroki
• Matsuura Katsuya
• Kondo Yasuhiro

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/30

  Die-attach connectors · CPC title