Chip component and method of producing the same

Patent metadata

Field	Value
Publication number	US-9972427-B2
Application number	US-201615271882-A
Country	US
Kind code	B2
Filing date	Sep 21, 2016
Priority date	Feb 3, 2012
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO 2 , TiN, TiNO and TiSiON.

First claim

The invention claimed is:

1. A chip resistor, comprising:
a substrate;
a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film;
an electrode provided on the substrate; and
a plurality of fuses disconnectably connecting the plurality of resistor elements to the electrode, wherein
the resistive film is made of at least one material selected from the group consisting of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO 2 , TiN, TiNO and TiSiON; and wherein
the plurality of resistor elements each include a linear element, and conductive film pieces provided on the resistive film and spaced a predetermined distance from each other in a linear element extending direction, and
a portion of the resistive film not provided with the conductive film pieces spaced the predetermined distance from each other functions as a single unit resistor body.

2. The chip resistor according to claim 1 , wherein the resistive film has a temperature coefficient of less than 1000 ppm/° C.

3. The chip resistor according to claim 2 , wherein the temperature coefficient of the resistive film is 50 ppm/° C. to 200 ppm/° C.

4. The chip resistor according to claim 1 , wherein the resistive film has a thickness of 300 Å to 1 μm.

5. The chip resistor according to claim 1 , wherein the linear element has a line width of 1 μm to 1.5 μm.

6. The chip resistor according to claim 1 , wherein the conductive film pieces provided on the resistive film and the fuses are metal films provided at the same level and made of the same material.

7. The chip resistor according to claim 1 , wherein unit resistor bodies are connected in series to one another to form a resistor circuit.

8. The chip resistor according to claim 7 , wherein
the resistor circuit includes plural types of resistor circuits which include plural types of serial resistor circuits each including unit resistor bodies whose number is defined by an increasing geometric progression, the unit resistor bodies being connected in series to one another and having the same resistance value.

9. The chip resistor according to claim 7 , wherein
the resistor circuit includes plural types of resistor circuits which include plural types of parallel resistor circuits each including unit resistor bodies whose number is defined by an increasing geometric progression, the unit resistor bodies being connected in parallel to one another and having the same resistance value.

10. The chip resistor according to claim 7 , wherein
the resistor circuit includes plural types of resistor circuits which include plural types of serial resistor circuits and parallel resistor circuits,
the serial resistor circuits each includes unit resistor bodies whose number is defined by an increasing geometric progression, the unit resistor bodies of each of the serial resistor circuits being connected in series to one another and having the same resistance value,
the parallel resistor circuits each includes unit resistor bodies whose number is defined by an increasing geometric progression, the unit resistor bodies of each of the parallel resistor circuits being connected in parallel to one another and having the same resistance value.

Assignees

• Rohm Co Ltd

Inventors

• Kondo Yasuhiro
• Tamagawa Hiroshi
• Yamamoto Hiroki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W20/493

  Fuses, i.e. interconnections changeable from conductive to non-conductive · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01G5/38

  Multiple capacitors, e.g. ganged · CPC title

• H01L27/0207

  Electricity · mapped topic