Chip resistor

Patent metadata

Field	Value
Publication number	US-10410772-B2
Application number	US-201715454864-A
Country	US
Kind code	B2
Filing date	Mar 9, 2017
Priority date	Dec 28, 2011
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

A chip resistor has a substrate, a first connection electrode and a second connection electrode that are formed on the substrate, and a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and the other one of which is connected to the second connection electrode. The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line that is provided along inner wall surfaces of trenches. The resistive element film line extending along the inner wall surfaces of the trenches is long and has a high resistivity as a unit resistive element.

First claim

The invention claimed is:

1. A chip resistor, comprising:
a substrate having a circuit forming surface;
a first connection electrode and a second connection electrode that are formed on the substrate;
a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and an opposite one of which is connected to the second connection electrode, the resistor network including:
a first resistive circuit arranged by a first resistive element film formed on the substrate,
a second resistive circuit arranged by a second resistive element film laid on the first resistive circuit with an interlayer insulating film therebetween, and
a connection circuit to connect the first resistive circuit and the second resistive circuit together in series; and

a fuse film that is fusible to electrically incorporate an arbitrary resistive circuit included in the resistor network into the resistor network or that is fusible to electrically separate the arbitrary resistive circuit from the resistor network.

2. The chip resistor according to claim 1 , wherein each of the first resistive element film and the second resistive element film has a line-shaped resistive element film line that has a constant width and that extends linearly.

3. The chip resistor according to claim 2 , wherein at least one of the first resistive circuit and the second resistive circuit includes a plurality of conductor film pieces that are laid on the resistive element film line at constant intervals in a line direction, and a resistive element film line part at a part of an interval on which a conductor film piece is not laid forms one unit resistive element.

4. The chip resistor according to claim 3 , wherein the first resistive circuit includes the plurality of conductor film pieces, and the fuse film which is made of a same material as the plurality of conductor film pieces is formed at a same layer as a laying layer of the plurality of conductor film pieces.

5. The chip resistor according to claim 1 , wherein each of the first resistive circuit and the second resistive circuit is formed in a same layout pattern when viewed planarly.

6. The chip resistor according to claim 1 , wherein, the resistor network includes a plurality of types of resistive circuits that have mutually different resistance values.

7. The chip resistor according to claim 6 , wherein the fuse film is fusible to electrically incorporate the plurality of types of resistive circuits included in the resistor network selectively into the resistor network or is fusible to electrically separate the plurality of types of resistive circuits included therein from the resistor network.

8. The chip resistor according to claim 1 , wherein the first resistive circuit has a plurality of unit resistive elements made of the first resistive element film, the second resistive circuit has a plurality of unit resistive elements made of the second resistive element film, and each unit resistive element included in the second resistive circuit is connected in series by the connection circuit to each unit resistive element included in the first resistive circuit.

9. The chip resistor according to claim 1 , wherein the first resistive element film and the second resistive element film are made of TiN or TiON or TiSiON.

10. The chip resistor according to claim 1 , wherein an area of a region in which the resistor network is formed and an area of a region in which the first connection electrode or the second connection electrode or the pair of external connection electrodes is disposed are substantially equal to each other in area ratio when the chip resistor is viewed planarly.

11. A chip resistor, comprising:
a substrate having a circuit forming surface;
a first connection electrode and a second connection electrode that are formed on the substrate; and
a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and an opposite one of which is connected to the second connection electrode, the resistor network including:
a first resistive circuit formed on a circuit forming surface positioned between the first connection electrode and the second connection electrode on the substrate,
a second resistive circuit formed under at least one of the first connection electrode and the second connection electrode, and
a connection circuit to connect the first resistive circuit and the second resistive circuit together in series, and

a fuse film that is fusible to electrically incorporate an arbitrary resistive circuit included in the resistor network into the resistor network or that is fusible to electrically separate the arbitrary resistive circuit from the resistor network.

Assignees

• Rohm Co Ltd

Inventors

• Tamagawa Hiroshi
• Kondo Yasuhiro

Classifications

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H05K2201/10212

  Programmable component · CPC title

• H01C1/012

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C17/23

  by opening or closing resistor geometric tracks of predetermined resistive values, {e.g. snapistors} · CPC title