Stable catalysts for electroless metallization

Patent metadata

Field	Value
Publication number	US-9611549-B2
Application number	US-201514742814-A
Country	US
Kind code	B2
Filing date	Jun 18, 2015
Priority date	Aug 17, 2011
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.

First claim

What is claimed is:

1. A method comprising:
a) providing a substrate;
b) applying an aqueous catalyst solution to the substrate, the aqueous catalyst solution comprises one or more antioxidants, nanoparticles of metal chosen from silver, gold, platinum, iridium, copper, aluminum, cobalt, nickel and iron, and one or more compounds chosen from polymers having a formula:

wherein R 1 , R 2 , R 3 , R 4 , R 5 , R 6 and R 7 are the same or different and chosen from —H, —CH 3 , —CH 2 CH 3 , —CH 2 OH, —[CH 2 CHR 8 ] x —OH, —CH 2 CH(OH)CH 3 , —(CH 2 CHR 8 O) y —H, —CH 2 COOX, —C(O)—CH 3 , —C(O)—(CH 2 ) z —CH 3 and

wherein R 8 is —H or —CH 3 , n is an integer of at least 2, x, y and z are integers of at least 1 and X is —H or a counter cation, and a reaction product of a polymer having a formula:

wherein R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , and R 15 are the same or different and are chosen from —H, —CH 3 , —CH 2 CH 3 , —CH 2 OH, —[CH 2 CHR 8 ] x —OH, —CH 2 CH(OH)CH 3 , —(CH 2 CHR 8 O) y —H, with the proviso that at least one of R 9 , R 10 , R 11 , R 12 , R 13 , R 14 , and R 15 is —CH 2 OH, —[CH 2 CHR 8 ] x —OH, —CH 2 CH(OH)CH 3 or —(CH 2 CHR 8 O) y —H, wherein R 8 , n, x, y and z are as described above, and a quaternary compound having a formula:

wherein m is an integer from 1 to 16, Y is halogen, Z − is a counter anion, R 16 , R 17 and R 18 are the same or different and are —H, —CH 3 or —(CH 2 ) p —CH 3 , and R 19 is —H or —CH 3 and p is an integer of 1 to 9, and one or more cross-linking agents; and the aqueous catalyst solution is free of tin; and
c) electrolessly depositing metal onto the substrate using an electroless metal plating bath.

2. The method of claim 1 , wherein the substrate comprises a plurality of through-holes.

3. The method of claim 1 , wherein the electroless metal plating bath is chosen from a copper, copper alloy, nickel and nickel alloy bath.

4. The method of claim 1 , wherein at least one of R 2 , R 3 , R 5 , R 6 and R 7 is —CH 2 COOX or —C(O)—CH 3 .

5. The method of claim 1 , wherein the cross-linking agent is chosen from one or more of haloepoxy compounds and di-epoxy compounds.

6. The method of claim 1 , wherein the nanoparticles are 1 nm to 1000 nm.

Assignees

• Rohm & Haas Elect Mat
• Rphm And Haas Electronic Mat Llc

Inventors

• Liu Feng
• Rzeznik Maria

Classifications

• B01J35/45

  Nanoparticles · CPC title

• C23C18/1803 Primary

  of metallic material surfaces or of a non-specific material surfaces · CPC title

• B01J37/16

  Reducing · CPC title

• B01J23/40

  of the platinum group metals · CPC title

• B01J31/28

  of the platinum group metals, iron group metals or copper · CPC title