Pretreatment method for photoresist wafer processing

Patent metadata

Field	Value
Publication number	US-9607822-B2
Application number	US-201615264262-A
Country	US
Kind code	B2
Filing date	Sep 13, 2016
Priority date	Apr 21, 2014
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Certain embodiments herein relate to methods and apparatus for processing a partially fabricated semiconductor substrate in a remote plasma environment. The methods may be performed in the context of wafer level packaging (WLP) processes. The methods may include exposing the substrate to a reducing plasma to remove photoresist scum and/or oxidation from an underlying seed layer. In some cases, photoresist scum is removed through a series of plasma treatments involving exposure to an oxygen-containing plasma followed by exposure to a reducing plasma. In some embodiments, an oxygen-containing plasma is further used to strip photoresist from a substrate surface after electroplating. This plasma strip may be followed by a plasma treatment involving exposure to a reducing plasma. The plasma treatments herein may involve exposure to a remote plasma within a plasma treatment module of a multi-tool electroplating apparatus.

First claim

What is claimed is:

1. A method of removing photoresist scum and electroplating metal into photoresist features, the method comprising:
(a) receiving a substrate in a multi-tool electroplating apparatus, the multi-tool electroplating apparatus comprising:
(i) at least one plasma treatment module comprising a plasma treatment chamber and a plasma generation chamber connected to the plasma treatment chamber; and
(ii) at least one electroplating module comprising an electroplating chamber;
wherein the substrate comprises:
(i) a metal seed layer, and
(ii) a layer of photoresist over and directly in contact with the metal seed layer, wherein the layer of photoresist comprises photoresist features patterned therein, and wherein a bottom of the photoresist features comprise photoresist scum;

(b) generating a reducing plasma from a reducing plasma generation gas in the plasma generation chamber;
(c) flowing the reducing plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the reducing plasma, react the photoresist scum with the reducing plasma, and remove at least a portion of the photoresist scum; and
(d) transferring the substrate to the electroplating module and electroplating metal on the metal seed layer in the photoresist features.

2. The method of claim 1 , wherein the reducing plasma generation gas comprises one or more of hydrogen, ammonia, nitrogen, carbon monoxide, diborane, sulfite compounds, hydrocarbons, phosphites, and/or hydrazine.

3. The method of claim 1 , wherein the reducing plasma generation gas comprises hydrogen.

4. The method of claim 1 , further comprising:
(e) after electroplating in (d), transferring the substrate to the plasma treatment chamber, generating a stripping plasma in the plasma generation chamber from a stripping plasma generation gas, flowing the stripping plasma from the plasma generation chamber into the plasma treatment chamber, exposing the substrate to the stripping plasma, and thereby reacting the stripping plasma with the layer of photoresist to strip the layer of photoresist from the substrate.

5. The method of claim 4 , wherein the stripping plasma generation gas comprises oxygen and/or CO 2 .

6. The method of claim 4 , wherein operation (e) forms oxidized portions of the metal seed layer, and further comprising:
(f) after stripping the layer of photoresist in (e), generating a second reducing plasma in the plasma generation chamber from a second reducing plasma generation gas, flowing the second reducing plasma from the plasma generation chamber into the plasma treatment chamber, exposing the substrate to the second reducing plasma, and thereby reacting the oxidized portions of the metal seed layer with the second reducing plasma to reduce the oxidized portions of the metal seed layer.

7. The method of claim 6 , wherein the second reducing plasma generation gas comprises one or more of hydrogen, ammonia, nitrogen, carbon monoxide, diborane, sulfite compounds, hydrocarbons, phosphites, and/or hydrazine.

8. The method of claim 1 , wherein the reducing plasma is substantially free of oxidizing species.

9. The method of claim 8 , wherein the layer of photoresist is not exposed to an oxidizing plasma between the time it is developed and the time at which operations (b)-(c) occur.

10. A multi-tool electroplating apparatus for removing photoresist scum and electroplating metal in features on a semiconductor substrate having a metal seed layer under an exposed layer of patterned photoresist, comprising:
(i) a plasma treatment module comprising a plasma treatment chamber connected with a plasma generation chamber;
(ii) an electroplating module comprising an electroplating chamber;
(iii) a transfer mechanism for transferring the substrate between the plasma treatment module and the electroplating module; and
(iv) a controller having instructions to:
(a) transfer the substrate into the plasma treatment chamber of the plasma treatment module;
(b) generate a reducing plasma in the plasma generation chamber from a reducing plasma generation gas, and flow the reducing plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the reducing plasma and react the photoresist scum with the reducing plasma to remove at least a portion of the photoresist scum;
(c) transfer the substrate from the plasma treatment chamber to the electroplating chamber via the transfer mechanism; and
(d) electroplate metal on the metal seed layer in the features in the patterned photoresist.

11. The apparatus of claim 10 , the controller further having instructions to:
(e) after electroplating in (d), transfer the substrate from the electroplating chamber to the plasma treatment chamber via the transfer mechanism;
(f) generate a stripping plasma in the plasma generation chamber from a stripping plasma generation gas, and flow the stripping plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the stripping plasma and react the stripping plasma with the layer of patterned photoresist to strip the patterned photoresist from the substrate.

12. The apparatus of claim 11 , the controller further having instructions to:
(g) after stripping photoresist in (f), generate a second reducing plasma in the plasma generation chamber from a second reducing plasma generation gas, and flow the second reducing plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the second reducing plasma and react the second reducing plasma with oxidized portions of the metal seed layer to thereby reduce the oxidized portions of the metal seed layer.

13. A multi-tool electroplating apparatus for removing photoresist scum and electroplating metal in features on a semiconductor substrate having a metal seed layer under an exposed layer of patterned photoresist, comprising:
(i) a plasma treatment module comprising a plasma treatment chamber connected with a plasma generation chamber;
(ii) an electroplating module comprising an electroplating chamber;
(iii) a transfer mechanism for transferring the substrate between the plasma treatment module and the electroplating module; and
(iv) a controller having instructions to:
(a) transfer the substrate into the plasma treatment chamber of the plasma treatment module;
(b) generate a first oxidizing plasma in the plasma generation chamber from a first oxidizing plasma generation gas, and flow the first oxidizing plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the first oxidizing plasma and react the first oxidizing plasma with the photoresist scum to remove at least a portion of the photoresist scum and form oxidized portions of the metal seed layer;
(c) generate a reducing plasma in the plasma generation chamber from a reducing plasma generation gas, and flow the reducing plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the reducing plasma and react the oxidized portions of the metal seed layer with the reducing plasma to reduce the oxidized portions of the metal seed layer;
(d) transfer the substrate from the plasma treatment chamber to the electroplating chamber via the transfer mechanism; and
(e) electroplate metal on the metal seed layer in the features in the patterned photoresist.

14. The apparatus of claim 13 , the controller further having instructions to:
(f) after electroplating in (e), transfer the substrate from the electroplating chambe

Assignees

• Lam Res Corp

Inventors

• Buckalew Bryan L
• Rea Mark L

Classifications

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/934

  Cross-sectional shape, i.e. in side view · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title