Thermosetting resin composition and prepreg and laminate obtained with the same

Patent metadata

Field	Value
Publication number	US-9603244-B2
Application number	US-44326007-A
Country	US
Kind code	B2
Filing date	Sep 10, 2007
Priority date	Sep 29, 2006
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.

First claim

What is claimed is:

1. A thermosetting resin composition comprising:
(A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by reacting (a-1) a maleimide compound having at least two N-substituted maleimide groups in a molecule with (a-2) an amine compound having an acidic substituent represented by the following Formula (1) in an organic solvent, a use amount of the organic solvent being 10 to 1000 parts by mass per 100 parts by mass of the sum of the maleimide compound (a-1) and the amine compound (a-2),
(B) a 6-substituted guanamine compound represented by the following Formula (2) and/or dicyandiamide,
(C) a copolymer resin comprising (c-1) a monomer unit represented by the following Formula (3) and (c-2) a monomer unit represented by the following Formula (4), and
(D) an epoxy resin having at least two epoxy groups in a molecule:

wherein R 1 each represents independently an acidic substituent selected from a hydroxyl group, a carboxy group and a sulfonic acid group; R 2 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; x is an integer of 1 to 5, and y is an integer of 0 to 4; and a sum of x and y is 5;

wherein R 3 represents phenyl, methyl, allyl, butyl, methoxy or benzyloxy;

wherein R 4 and R 5 each represent independently a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 5 carbon atoms, a phenyl group or a substituted phenyl group;

wherein the curing agent (A) comprises a compound represented by the following Formula (5) or the following Formula (6):

wherein R 1 , R 2 , x and y represent the same ones as in Formula (1); R 6 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom;

wherein R 1 , R 2 , x and y represent the same ones as in Formula (1); R 7 and R 8 each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group or a group represented by the following Formula (7):

and the organic solvent.

2. The thermosetting resin composition according to claim 1 , wherein an equivalent ratio of (a-1) the maleimide compound and of (a-2) the amine compound used in the organic solvent falls within a range of 1.0≦(equivalent of maleimide group in (a-1) the maleimide compound/equivalent of (a-2) the amine compound in terms of —NH 2 group)≦10.0.

3. The thermosetting resin composition according to claim 1 , which includes 1 to 95 parts by mass of component (A) based on 100 parts by mass of the sum of the masses of the component (A) having an acidic substituent and an unsaturated maleimide group in terms of a solid matter and masses of the components (B)-(D).

4. The thermosetting resin composition according to claim 3 , which also includes 1 to 95 parts by mass of the component (B), 1 to 50 parts by mass of the component (C), and 1 to 95 parts by mass of the component (D), each based on 100 parts by mass of said sum.

5. The thermosetting resin composition according to claim 1 , wherein said maleimide compound is bis(4-maleimidephenyl)methane, and said amine compound is m-aminophenol.

6. The thermosetting resin composition according to claim 1 , wherein said maleimide compound is selected from the group consisting of bis(4-maleimidephenyl)methane, m-phenylenebismaleimide and bis(4-maleimidephenyl)sulfone, and said amine compound is selected from the group consisting of m-aminophenol and p-aminophenol.

7. The thermosetting resin composition according to claim 1 , wherein the component (B) includes the 6-substituted guanamine compound, the 6-substituted guanamine compound being selected from the group consisting of benzoguanamine and 2,4-diamino-6-vinyl-s-triazine.

8. The thermosetting resin composition according to claim 1 , which consists essentially of (A) the curing agent, (B) the 6-substituted guanamine compound and/or dicyandiamide, (C) the copolymer resin and (D) the epoxy resin.

9. The thermosetting resin composition according to claim 1 , wherein said organic solvent is selected from the group consisting of cyclohexanone, propylene glycol monomethyl ether, and methyl cellosolve.

10. The thermosetting resin composition according to claim 1 , wherein the use amount of the organic solvent is 200 to 500 parts by mass per 100 parts by mass of the sum of the maleimide compound (a-1) and the amine compound (a-2).

11. The thermosetting resin composition according to claim 1 , wherein said organic solvent is selected from the group consisting of dimethylacetamide and propylene glycol monomethyl ether.

12. A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to claim 1 and then subjecting it to a B stage.

13. A laminated plate obtained by laminating and molding the prepreg according to claim 12 .

14. The laminated plate according to claim 13 , wherein it is a metal clad laminated plate obtained by superposing a metal foil on one side of the prepreg and then heating, pressing and molding it.

Assignees

• Tsuchikawa Shinji
• Kotake Tomohiko
• Akiyama Masanori
• Hitachi Chemical Co Ltd

Inventors

• Tsuchikawa Shinji
• Kotake Tomohiko
• Akiyama Masanori

Classifications

• C08L25/08

  Copolymers of styrene (C08L29/08, C08L35/06, C08L55/02 take precedence) · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• Y10T428/31678

  Of metal · CPC title

• C08G73/124

  the unsaturated precursors containing oxygen in the form of ether bonds in the main chain · CPC title

• B32B2260/046

  Synthetic resin · CPC title