Adhesive resin composition, adhesive film, and flexible metal laminate

Patent metadata

Field	Value
Publication number	US-2017313916-A1
Application number	US-201515521359-A
Country	US
Kind code	A1
Filing date	Dec 8, 2015
Priority date	Dec 8, 2014
Publication date	Nov 2, 2017
Grant date	—

Abstract

The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

First claim

1 . An adhesive resin composition comprising: a styrene-ethylene-butylene-styrene copolymer to which 0.1 wt % to 15 wt % of dicarboxylic acid or an anhydride thereof is bonded;
an epoxy resin; a curing catalyst comprising one or more compounds selected from the group consisting of an imidazole-based compound, an imine-based compound, and an amine-based compound; and an acid anhydride compound, and wherein the adhesive resin composition has a dielectric constant of 2.8 or less in a dried state and at 5 GHz.

2 . The adhesive resin composition according to claim 1 ,
wherein the acid anhydride compound includes one or more compounds selected from the group consisting of a styrene-maleic anhydride copolymer, methyltetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl himic anhydride, NADIC methyl anhydride, NADIC anhydride, and dodecenyl succinic anhydride.

3 . The adhesive resin composition according to claim 1 ,
wherein the adhesive resin composition comprises, based on 100 parts by weight of the styrene-ethylene-butylene-styrene copolymer to which 0.1 wt % to 15 wt % of dicarboxylic acid or anhydride thereof is bonded: 10 to 80 parts by weight of the epoxy resin; 10 to 80 parts by weight of the acid anhydride compound; and 0.05 to 5 parts by weight of the curing catalyst comprising one or more compounds selected from the group consisting of an imidazole-based compound, an imine-based compound, and an amine-based compound.

4 . The adhesive resin composition according to claim 1 ,
wherein the adhesive resin composition has a dielectric loss factor (Df) of 0.010 or less in a dried state and at 5 GHz.

5 . The adhesive resin composition according to claim 1 ,
wherein a weight ratio of the epoxy resin to the acid anhydride compound is 2.0 to 0.05.

6 . The adhesive resin composition according to claim 1 ,
further comprising 50 to 1000 parts by weight of an organic solvent, based on 100 parts by weight of the styrene-ethylene-butylene-styrene copolymer.

7 . The adhesive resin composition according to claim 6 ,
wherein a viscosity of the adhesive resin composition changes by a ratio of 2 times or less compared to the initial viscosity within 72 hours, when exposed to the outside at room temperature.

8 . The adhesive resin composition according to claim 1 ,
wherein the styrene-ethylene-butylene-styrene copolymer to which 0.1 wt % to 15 wt % of dicarboxylic acid or an anhydride thereof is bonded has a weight average molecular weight of 30,000 to 800,000.

9 . The adhesive resin composition according to claim 1 ,
wherein the styrene-ethylene-butylene-styrene copolymer to which 01 wt % to 15 wt % of dicarboxylic acid or an anhydride thereof is bonded comprises 5 to 50 wt % of styrene-derived repeat units.

10 . The adhesive resin composition according to claim 1 ,
wherein the dicarboxylic acid includes one or more selected from the group consisting of maleic acid, phthalic acid, itaconic acid, citraconic acid, alkenyl succinic acid, cis-1,2,3,6-tetrahydrophthalic acid, and 4-methyl-1,2,3,6-tetrahydrophthalic acid.

11 . The adhesive resin composition according to claim 1 ,
wherein the epoxy resin includes one or more selected from the group consisting of biphenyl novolac epoxy resin, bisphenol A type of epoxy resin, and dicylcopentadiene phenol addition reaction type epoxy resin.

12 . The adhesive resin composition according to claim 2 ,
wherein the styrene-maleic anhydride copolymer has a weight average molecular weight of 1000 to 50,000.

13 . The adhesive resin composition according to claim 2 ,
wherein the styrene-maleic anhydride copolymer comprises 50 wt % to 95 wt % of styrene-derived repeat units.

14 . An adhesive film comprising a cured product of the adhesive resin composition of claim 1 , and having a dielectric constant (Dk) of 2.8 or less in a dried state and at 5 GHz.

15 . The adhesive film according to claim 14 ,
wherein the adhesive film has a dielectric loss factor (Df) of 0.010 or less in a dried state and at 5 GHz.

16 . The adhesive film according to claim 14 ,
wherein the adhesive film has a thickness of 1 μm to 100 μm.

17 . A flexible metal laminate comprising: a polyimide resin film;
a metal thin film comprising one or more selected from the group consisting of copper, iron, nickel, titanium, aluminum, silver, gold, and alloys of two or more kinds thereof; and the adhesive film of claim 12 formed between the polyimide film and the metal thin film.

18 . The flexible metal laminate according to claim 17 ,
wherein the polyimide resin film has a thickness of 1 μm to 50 μm, and the polyimide resin film contains 5 to 75 wt % of a fluorine-based resin.

19 . The flexible metal laminate according to claim 17 ,
wherein the adhesive film has a dielectric constant (Dk) of 2.2 to 2.8 in a dried state and at 5 GHz.

20 . The flexible metal laminate according to claim 17 ,
wherein the adhesive film has a dielectric loss factor (Df) of 0.010 or less in a dried state and at 5 GHz.

Assignees

• Lg Chemical Ltd

Inventors

• Tae Young Ji
• Park Young Seok
• Ahn Byeong In

Classifications

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• C08G59/5073

  having two nitrogen atoms in the ring · CPC title

• C09J155/00

  Adhesives based on homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C09J123/00 - C09J153/00 · CPC title

• B32B27/322

  comprising halogenated polyolefins, e.g. PTFE · CPC title