Heat-curable maleimide resin composition
US-12162971-B2 · Dec 10, 2024 · US
the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
the unsaturated precursors containing oxygen in the form of ether bonds in the main chain · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G73/124 |
| Official title | {the unsaturated precursors containing oxygen in the form of ether bonds in the main chain} |
| Display label | the unsaturated precursors containing oxygen in the form of ether bonds in the main chain |
| Total patents | 76 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 3 |
| 2017 | 5 |
| 2018 | 3 |
| 2019 | 3 |
| 2020 | 5 |
| 2021 | 3 |
| 2022 | 13 |
| 2023 | 11 |
| 2024 | 14 |
| 2025 | 11 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor device
US-2024247128-A1 · Jul 25, 2024 · US
Heat-curable citraconimide resin composition
US-12012485-B2 · Jun 18, 2024 · US
Bismaleimide compound, resin varnish, and production method thereof
US-2024182646-A1 · Jun 6, 2024 · US
Modified bismaleimide resin
US-2024174811-A1 · May 30, 2024 · US
Dielectric materials based on amide-imide-extended bismaleimides
US-2024174805-A1 · May 30, 2024 · US
Lightly crosslinked polyimides with phenylethynyl pendants for shape-memory effect and programmed enhancement in Tg and modulus
US-11992995-B2 · May 28, 2024 · US
Multiphenylethynyl-containing and lightly crosslinked polyimides capable of memorizing shapes and augmenting thermomechanical stability
US-11975477-B2 · May 7, 2024 · US
Curable resin composition for bonding film, bonding film, and printed-wiring board
US-2024117120-A1 · Apr 11, 2024 · US
Curable compound product
US-2024067777-A1 · Feb 29, 2024 · US
Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package
US-2024032209-A1 · Jan 25, 2024 · US
Dielectric materials based on bismaleimides containing cardo/spiro moieties
US-2024010796-A1 · Jan 11, 2024 · US
Thermoset polymers for high temperature applications
US-2023312870-A1 · Oct 5, 2023 · US
Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device
US-2023305400-A1 · Sep 28, 2023 · US
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
US-2023257581-A1 · Aug 17, 2023 · US
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
US-2023250282-A1 · Aug 10, 2023 · US
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
US-2023250281-A1 · Aug 10, 2023 · US
Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device
US-2023250233-A1 · Aug 10, 2023 · US
Thermoset composite comprising a crosslinked imide extended compound
US-2023242709-A1 · Aug 3, 2023 · US
Resin composition, preparation method thereof and article made therefrom
US-11697711-B2 · Jul 11, 2023 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G73/124?
- CPC C08G73/124 is the Cooperative Patent Classification code for “the unsaturated precursors containing oxygen in the form of ether bonds in the main chain.”
- How many patents are filed under CPC C08G73/124 (the unsaturated precursors containing oxygen in the form of ether bonds in the main chain)?
- Our database includes 76 publications tagged with this CPC code.
- Is patent activity under CPC C08G73/124 growing?
- Publication counts under this code: 14 in 2024 vs 11 in 2025 (latest complete years).