Peeling device, peeling system, and peeling method

Patent metadata

Field	Value
Publication number	US-9601365-B2
Application number	US-201414263471-A
Country	US
Kind code	B2
Filing date	Apr 28, 2014
Priority date	May 10, 2013
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.

First claim

What is claimed is:

1. A peeling device configured to separate a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, the peeling device comprising:
a holding unit configured to hold the superposed substrate; and
a plurality of position adjustment units movable toward and away from a side surface of the superposed substrate held in the holding unit, and the plurality of position adjustment units configured to perform a position adjustment of the superposed substrate relative to the holding unit by contacting the side surface of the superposed substrate and laterally moving the superposed substrate.

2. The peeling device of claim 1 , wherein the holding unit holds the target substrate of the superposed substrate, and
wherein each of the plurality of position adjustment units comes into contact with a side surface of the support substrate of the superposed substrate held in the holding unit to perform the position adjustment of the superposed substrate.

3. The peeling device of claim 1 , wherein a plurality of holes configured to eject a gas is formed on a surface of the holding unit.

4. The peeling device of claim 1 , wherein the superposed substrate is disposed inside an annular frame and held by a tape attached to a back side of the annular frame and a non joint surface of the target substrate.

5. The peeling device of claim 4 , wherein each of the plurality of position adjustment units is movable such that it comes into contact with the side surface of the superposed substrate without contacting the annular frame.

6. The peeling device of claim 4 , further comprising:
a pressing unit configured to push the annular frame vertically downward with respect to the superposed substrate; and
a peeling inducement unit configured to form a peeling initiation region in which a process of peeling off of the target substrate from the support substrate is initiated on a side surface of one end of the superposed substrate,
wherein the pressing unit has a ball bearing that comes into contact with a surface of the annular frame.

7. The peeling device of claim 6 , wherein the peeling inducement unit has a blade, and a movement mechanism configured to move the blade toward the side surface of the one end of the superposed substrate, and
wherein the blade is attachable to or detachable from the movement mechanism.

8. The peeling device of claim 1 , further comprising:
a delivery unit configured to deliver the superposed substrate between an outside of the peeling device and the holding unit; and
a guide unit configured to perform a position adjustment of the superposed substrate with respect to the holding unit, and installed in the delivery unit.

9. A peeling system including the peeling device according to claim 1 , comprising:
a peeling station including the peeling device;
a carry-in/carry-out station configured to carry the target substrate, the support substrate, or the superposed substrate into and out of the peeling station; and
a transfer device configured to transfer at least one of the target substrate, the support substrate, and the superposed substrate between the peeling station and the carry-in/carry-out station.

10. A peeling method of separating a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, comprising:
holding the superposed substrate by a holding unit;
performing a position adjustment of the superposed substrate relative to the holding unit by making a plurality of position adjustment units contacted with a side surface of the superposed substrate held by the holding unit and making the superposed substrate move in a lateral direction; and
separating the superposed substrate that is subjected to the position adjustment in the holding unit into the target substrate and the support substrate.

11. The peeling method of claim 10 , wherein in the holding the superposed substrate, the target substrate of the superposed substrate is held on the holding unit, and
wherein in performing the position adjustment, the position adjustment of the superposed substrate is performed by making the plurality of position adjustment units contacted with a side surface of the support substrate of the superposed substrate held on the holding unit.

12. The peeling method of claim 10 , wherein in holding the superposed substrate and in performing the position adjustment, a gas is ejected from a surface of the holding unit to float the superposed substrate from the holding unit.

13. The peeling method of claim 10 , wherein the superposed substrate is disposed inside an annular frame and is held by a tape attached to a back side of the annular frame and a non-joint surface of the target substrate.

14. The peeling method of claim 13 , wherein in performing the position adjustment, each of the plurality of position adjustment units moves until it comes into contact with the side surface of the superposed substrate without contacting the annular frame.

15. The peeling method of claim 13 , wherein in separating the superposed substrate, after the annular frame is vertically pushed downward with respect to the superposed substrate while a ball bearing of a pressing unit is in contact with a surface of the annular frame, a peeling initiation region in which a process of peeling off of the target substrate from the support substrate is initiated, is formed on a side surface of one end of the superposed substrate by a peeling inducement unit.

16. The peeling method of claim 10 , further comprising:
delivering the superposed substrate to the holding unit from an outside of the peeling device by a delivery unit before the holding the superposed substrate,
wherein in delivering the superposed substrate, when the superposed substrate is held by the delivery unit, the position adjustment of the superposed substrate with respect to the holding unit is performed by a guide unit installed in the delivery unit.

17. A peeling device configured to separate a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, the peeling device comprising:
a holding unit configured to hold the superposed substrate; and
a plurality of position adjustment units movable toward and away from a side surface of the superposed substrate held in the holding unit, and the plurality of position adjustment units configured to perform a position adjustment of the superposed substrate relative to the holding unit by contacting the side surface of the superposed substrate,
wherein each of the plurality of position adjustment units includes an arm unit which is an elongated member and a rotational movement mechanism configured to rotate the arm unit, and
wherein the arm unit has a leading end and the leading end comes into contact with a side surface of the superposed wafer substrate when the arm unit is rotated by the rotational movement mechanism until the leading end is directed vertically and downwardly.

18. A peeling method of separating a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, comprising:
holding the superposed substrate by a holding unit;
performing a position adjustment of the superposed substrate relative to the hold

Assignees

• Tokyo Electron Ltd

Inventors

• Honda Masaru
• Sakamoto Ryoichi

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• B32B2309/62

  Inert · CPC title

• B32B38/10

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• Y10T156/1179

  with poking during delaminating [e.g., jabbing, etc.] · CPC title