Apparatus and method for three-dimensional printing
US-11498265-B2 · Nov 15, 2022 · US
Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package
US2024063048A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024063048-A1 |
| Application number | US-202217889362-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 16, 2022 |
| Priority date | Aug 16, 2022 |
| Publication date | Feb 22, 2024 |
| Grant date | — |
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Abstract
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A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardness scale of the gas permeable buffer layer is smaller than a hardness scale of the supporting platform.
First claim
Opening claim text (preview).
What is claimed is: 1 . A manufacturing method of a semiconductor package; comprising: forming a backside redistribution structure over a carrier; forming an encapsulated semiconductor device over the backside redistribution structure; forming a front side redistribution structure over the encapsulated semiconductor device to form a package structure; removing the carrier from the package structure and revealing a back surface of the backside redistribution structure; pr…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2024063048A1 cover?
- A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardne…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/78. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 22 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).