Magnetic-field-generating apparatus for magnetron sputtering

Patent metadata

Field	Value
Publication number	US-9580797-B2
Application number	US-201213981252-A
Country	US
Kind code	B2
Filing date	Jan 12, 2012
Priority date	Jan 24, 2011
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A racetrack-shaped magnetic-field-generating apparatus for magnetron sputtering comprising a linear portion and corner portions, the linear portion comprising a magnetic base, a center permanent magnet disposed on its surface, and side permanent magnets disposed on both sides thereof with a gap; the center and side permanent magnets being vertically magnetized with opposite polarities; the corner portions comprising a non-magnetic base, a center magnetic pole member disposed on its surface, a semicircular or semi-polygonal, peripheral magnetic pole member, and plural permanent magnets arranged between both magnetic pole members with their magnetization directions in parallel to a target surface; and the magnetic poles of plural permanent magnets opposing the center magnetic pole member having the same polarity as those of the center permanent magnet opposing the target.

First claim

What is claimed is:

1. A racetrack-shaped magnetic-field-generating apparatus for magnetron sputtering, which comprises a linear portion and corner portions to generate a magnetic field on a target surface,
said linear portion comprising a magnetic base, a center rectangular permanent magnet disposed on a surface of said magnetic base, and two side rectangular permanent magnets disposed on a surface of said magnetic base in parallel to and on both sides of said center permanent magnet with a gap;
said center permanent magnet and said side permanent magnets being arranged with their magnetization directions perpendicular to said target surface and their polarities opposite;
each of said corner portions comprising a non-magnetic base, a center magnetic pole member disposed on a surface of said non-magnetic base, a peripheral magnetic pole member disposed in a semicircular or semi-polygonal form with said center magnetic pole member as a center, and plural permanent magnets arranged between said center magnetic pole member and said peripheral magnetic pole member;
said plural permanent magnets being arranged with their magnetization directions in parallel to a surface of said target and the same polarity opposing said center magnetic pole member; and
the magnetic poles of said plural permanent magnets opposing said center magnetic pole member having the same polarity as that of the magnetic pole of said center permanent magnet facing said target.

2. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein said permanent magnets constituting said corner portions are fan-shaped or trapezoidal permanent magnets.

3. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein said permanent magnets constituting said corner portions occupy 30% or more of an area between said center magnetic pole member and said peripheral magnetic pole member.

4. The magnetic-field-generating apparatus for magnetron sputtering according to claim 3 , wherein a space between said center magnetic pole member and said peripheral magnetic pole member is filled with said permanent magnets, and non-magnetic spacers occupying other portions than said permanent magnets.

5. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein said linear portion is filled with a non-magnetic spacer between said center permanent magnet and said side permanent magnets.

6. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein positions at which a perpendicular component of a magnetic flux density of a magnetic field on said target surface is zero meet the requirement of R≦r, wherein r is a horizontal distance from said center magnetic pole member in said corner portions, and R is a horizontal distance from said center permanent magnet in said linear portion.

7. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein a horizontal component of a magnetic flux density at positions, at which a perpendicular component of said magnetic flux density on said target surface is zero, is 10 mT or more in said corner portions.

8. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein said center permanent magnet and said side permanent magnets constituting said linear portion are rare earth magnets, and said plural permanent magnets constituting said corner portions are ferrite magnets.

9. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein said linear portion is wider than each of said corner portions in a boundary in which said linear portion is opposing each of said corner portions.

10. The magnetic-field-generating apparatus for magnetron sputtering according to claim 1 , wherein magnetic shunts for adjusting a magnetic field are arranged in said corner portions on the side of said base with respect to said permanent magnets.

Assignees

• Kuriyama Yoshihiko
• Mita Masahiro
• Hitachi Metals Ltd

Inventors

• Kuriyama Yoshihiko
• Mita Masahiro

Classifications

• C23C14/351 Primary

  using a magnetic field in close vicinity to the substrate · CPC title

• H01J37/3461

  Means for shaping the magnetic field, e.g. magnetic shunts · CPC title

• H01J37/3408

  Planar magnetron sputtering · CPC title

• H01J37/3452

  Magnet distribution · CPC title

• C23C14/35 Primary

  by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)} · CPC title