Polishing method

Patent metadata

Field	Value
Publication number	US-9573245-B2
Application number	US-201414506562-A
Country	US
Kind code	B2
Filing date	Oct 3, 2014
Priority date	Oct 7, 2013
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A polishing method includes: rotating a polishing table that supports a polishing pad; polishing a conductive film by pressing a substrate having the conductive film against the polishing pad; obtaining a film thickness signal with use of an eddy current film-thickness sensor disposed in the polishing table; determining a thickness of the polishing pad based on the film thickness signal; determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad; calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined polishing time; calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness; and terminating polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when the thickness of the conductive film has reached the temporary end-point film thickness.

First claim

What is claimed is:

1. A polishing method, comprising:
rotating a polishing table that supports a polishing pad;
polishing a conductive film by pressing a substrate, having the conductive film formed on a surface thereof, against the polishing pad;
obtaining a film thickness signal, which varies in accordance with a thickness of the conductive film, with use of an eddy current film-thickness sensor disposed in the polishing table;
determining a thickness of the polishing pad based on the film thickness signal;
determining a polishing rate of the conductive film corresponding to the determined thickness of the polishing pad;
calculating an expected amount of polishing of the conductive film to be polished at the determined polishing rate for a predetermined polishing time;
calculating a temporary end-point film thickness by adding the expected amount of polishing to a target thickness of the conductive film; and
terminating the polishing of the conductive film when the predetermined polishing time has elapsed from a point of time when the thickness of the conductive film has reached the temporary end-point film thickness.

2. The polishing method according to claim 1 , wherein the polishing rate is determined from a polishing rate data indicating a relationship between thickness of the polishing pad and corresponding polishing rate.

3. The polishing method according to claim 1 , wherein the film thickness signal comprises a resistance component and an inductive reactance component of an electric circuit of the eddy current film-thickness sensor, and
wherein the thickness of the polishing pad is determined from a pad thickness data indicating a relationship between thickness of the polishing pad and impedance that is calculated from the resistance component and the inductive reactance component.

4. A polishing method, comprising:
rotating a polishing table that supports a polishing pad;
polishing a conductive film by pressing a substrate, having the conductive film formed on a surface thereof, against the polishing pad;
obtaining a thickness of the conductive film from output values of an eddy current film-thickness sensor disposed in the polishing table;
while polishing the conductive film, calculating an amount of polishing of the conductive film per one rotation of the polishing table based on the thickness of the conductive film obtained from output values of the eddy current film-thickness sensor;
calculating an additional polishing time from the amount of polishing of the conductive film and a difference between a current thickness of the conductive film and a target thickness;
calculating a target polishing time by adding the additional polishing time to a current polishing time at which the current thickness is obtained; and
terminating the polishing of the conductive film when the target polishing time is reached.

Assignees

• Ebara Corp

Inventors

• Takahashi Taro
• Kawabata Yasumitsu

Classifications

• B24B49/18 Primary

  taking regard of the presence of dressing tools · CPC title

• B24B37/013 Primary

  Devices or means for detecting lapping completion · CPC title