Polishing method and apparatus

Patent metadata

Field	Value
Publication number	US-9610673-B2
Application number	US-201414160928-A
Country	US
Kind code	B2
Filing date	Jan 22, 2014
Priority date	Jan 25, 2013
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

First claim

What is claimed is:

1. A polishing method for polishing a substrate, comprising:
a recipe process, being executed in accordance with a preset recipe, comprising:
a polishing step for polishing a surface of the substrate by pressing the substrate against a polishing pad on a polishing table by a top ring;
a dressing step for dressing the polishing pad; and
a first cleaning step for removing foreign matters on said polishing pad by ejecting a cleaning fluid onto said polishing pad, a cleaning time of said first cleaning step being preset in advance in said recipe process;

a second cleaning step for removing foreign matters on said polishing pad by ejecting a cleaning fluid onto said polishing pad, a cleaning time of said second cleaning step being variable; and
a substrate transferring process in which the polished substrate is removed from said top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto said top ring, and then said top ring holding the subsequent substrate to be polished is returned to said polishing table;
wherein said second cleaning step is started after the completion of said recipe process is detected, and said second cleaning step is terminated by detecting a position of the subsequent substrate to be polished which is undergoing said substrate transferring process.

2. The polishing method according to claim 1 , wherein said second cleaning step is terminated by detecting the arrival of the subsequent substrate to be polished which is undergoing said substrate transferring process to said substrate transferring position.

3. The polishing method according to claim 1 , wherein a rotational speed of said polishing table is varied in said polishing step and said second cleaning step.

4. The polishing method according to claim 3 , wherein the rotational speed of said polishing table at the time of said second cleaning step is higher than that at the time of said polishing step.

5. The polishing method according to claim 1 , further comprising a second recipe process including a second polishing step for polishing a surface of the substrate by pressing the substrate against a polishing pad on a second polishing table by a top ring, wherein said recipe processes in said respective polishing tables differ from each other.

6. A polishing apparatus capable of performing a polishing method;
said polishing method comprising:
a recipe process, being executed in accordance with a preset recipe, comprising:
a polishing step for polishing a surface of the substrate by pressing the substrate against a polishing pad on a polishing table by a top ring;
a dressing step for dressing the polishing pad; and
a first cleaning step for removing foreign matters on said polishing pad by ejecting a cleaning fluid onto said polishing pad, a cleaning time of said first cleaning step being preset in advance in said recipe process;

a second cleaning step for removing foreign matters on said polishing pad by ejecting a cleaning fluid onto said polishing pad, a cleaning time of said second cleaning step being variable; and
a substrate transferring process in which the polished substrate is removed from said top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto said top ring, and then said top ring holding the subsequent substrate to be polished is returned to said polishing table;
wherein said second cleaning step is started after the completion of said recipe process is detected, and said second cleaning step is terminated by detecting a position of the subsequent substrate to be polished which is undergoing said substrate transferring process.

7. The polishing apparatus according to claim 6 , wherein said second cleaning step is terminated by detecting the arrival of the subsequent substrate to be polished which is undergoing said substrate transferring process to said substrate transferring position.

8. The polishing apparatus according to claim 6 , wherein a rotational speed of said polishing table is varied in said polishing step and said second cleaning step.

9. The polishing apparatus according to claim 8 , wherein the rotational speed of said polishing table at the time of said second cleaning step is higher than that at the time of said polishing step.

10. The polishing apparatus according to claim 6 , further comprising a second recipe process including a second polishing step for polishing a surface of the substrate by pressing the substrate against a polishing pad on a second polishing table by a top ring, wherein said recipe processes in said respective polishing tables differ from each other.

Assignees

• Ebara Corp

Inventors

• Torikoshi Tsuneo

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P90/123

  by grinding or lapping · CPC title

• B24B49/00

  Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence) · CPC title

• B24B53/007

  Cleaning of grinding wheels · CPC title

• B24B37/345 Primary

  Feeding, loading or unloading work specially adapted to lapping · CPC title