Method and apparatus for conditioning a polishing pad

Patent metadata

Field	Value
Publication number	US-9469013-B2
Application number	US-201213488774-A
Country	US
Kind code	B2
Filing date	Jun 5, 2012
Priority date	Jun 8, 2011
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.

First claim

What is claimed is:

1. A method of conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate, the polishing pad to be brought into contact with the thin film to perform the polishing, said method comprising:
bringing a dresser into contact with the polishing pad, the dresser being capable of wearing down an entire surface of the polishing pad uniformly when the dresser is moved at an identified standard moving speed, the standard moving speed being defined as a preset moving speed of the dresser at each of a plurality of radially-extending areas of the polishing pad along a radial direction of the polishing pad to obtain an identical wear rate over the entire surface of the polishing pad; and
conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad;
wherein a moving speed of the dresser at a predetermined area of the polishing pad is higher than the standard moving speed of the dresser preset for the predetermined area of the polishing pad; and
wherein the predetermined area of the polishing pad is defined as the area of the polishing pad to be brought into contact with a portion of the surface of the substrate whereat a polishing rate will be lower than a polishing rate of any other portion of the surface of the substrate if the predetermined area of the polishing pad was conditioned by moving the dresser at the standard moving speed.

2. The method of conditioning a polishing pad according to claim 1 , wherein said moving speed of the dresser is an oscillating speed of the dresser which is oscillated about a swing shaft located outside the polishing table.

3. The method of conditioning a polishing pad according to claim 1 , wherein the polishing pad comprises a polishing pad having a plurality of holes in a surface thereof.

4. The method of conditioning a polishing pad according to claim 1 , further comprising polishing the thin film on the substrate using a polishing liquid containing ceria particles.

5. The method of conditioning a polishing pad according to claim 1 , further comprising polishing the thin film on the substrate and cooling the polishing pad by blowing a cooling gas on the polishing pad when the thin film on the substrate is polished.

6. The method of conditioning a polishing pad according to claim 1 , wherein the predetermined area of the polishing pad is an area which is to be brought into contact with a central area of the substrate during polishing of the substrate.

7. An apparatus for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate, the polishing pad to be brought into contact with the thin film to perform the polishing, said apparatus comprising:
a dresser configured to be brought into contact with the polishing pad, said dresser to be moved between a central part of the polishing pad and an outer circumferential part of the polishing pad for conditioning the polishing pad, the dresser being configured to wear down an entire surface of the polishing pad uniformly when the dresser is moved at an identified standard moving speed, the standard moving speed being defined as a preset moving speed of said dresser at each of a plurality of radially-extending areas of the polishing pad along a radial direction of the polishing pad to obtain an identical wear rate over the entire surface of the polishing pad; and
a controller configured to:
control said dresser such that a moving speed of said dresser at a predetermined area of the polishing pad is higher than the standard moving speed of said dresser preset for the predetermined area of the polishing pad;
wherein the predetermined area of the polishing pad is defined as the area of the polishing pad to be brought into contact with a portion of the surface of the substrate whereat a polishing rate will be lower than a polishing rate of any other portion of the surface of the substrate if the predetermined area of the polishing pad was conditioned by moving the dresser at the standard moving speed.

8. The apparatus for conditioning a polishing pad according to claim 7 , wherein the moving speed of said dresser is an oscillating speed of said dresser which is oscillated about a swing shaft located outside of said polishing table.

9. The apparatus for conditioning a polishing pad according to claim 7 , wherein the polishing pad comprises a polishing pad having a plurality of holes in a surface thereof.

10. The apparatus for conditioning a polishing pad according to claim 7 , further comprising a polishing liquid containing ceria particles to be used when the thin film on the substrate is polished.

11. The apparatus for conditioning a polishing pad according to claim 7 , further comprising a cooling nozzle for cooling the polishing pad by blowing a cooling gas on the polishing pad when the thin film on the substrate is polished.

12. The apparatus for conditioning a polishing pad according to claim 7 , wherein said predetermined area of said polishing pad is an area which is to be brought into contact with a central area of the substrate during polishing of the substrate.

Assignees

• Tanikawa Mutsumi
• Shimano Takahiro
• Ebara Corp

Inventors

• Tanikawa Mutsumi
• Shimano Takahiro

Classifications

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B53/02

  of plane surfaces on abrasive tools (B24B53/017 takes precedence) · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B49/18

  taking regard of the presence of dressing tools · CPC title

• B24B49/006

  taking regard of the speed · CPC title