Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate

Patent metadata

Field	Value
Publication number	US-9491881-B2
Application number	US-201414164403-A
Country	US
Kind code	B2
Filing date	Jan 27, 2014
Priority date	Jan 27, 2014
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A microelectronic socket having a two piece construction, wherein a first piece comprises a conductive socket substrate and the second piece comprises an insulative insert. The conductive socket substrate has a first surface, a second surface, and at least one opening extending therebetween. The insulative insert has a base portion with at least one projection extending therefrom. The insulative insert is mated with the conductive socket substrate such that the at least one projection resides within a corresponding conductive socket substrate opening. The insulative insert further includes a plurality of vias, wherein at least one of the plurality of vias extends through the insulative base and through an insulative insert projection, wherein a contact may be disposed within the via.

First claim

What is claimed is:

1. A microelectronic socket, comprising:
a conductive socket substrate having a first surface, a second surface, and a plurality of openings extending from the conductive socket substrate first surface to the conductive socket second surface, wherein the conductive socket substrate comprises a non-conductive core and a conductive material on an exterior surface of the non-conductive core;
an insulative insert comprising a base portion having a first surface and a second surface, and a plurality of projections extending from the insulative insert base portion second surface, wherein the insulative insert is mated with the conductive socket substrate such that each of the plurality of insulative insert projections resides within a corresponding conductive socket substrate opening;
a plurality of vias, wherein at least one of the plurality of vias extends from the insulative base portion first surface through one of the plurality of insulative insert projections;
a plurality of contacts, wherein at least one of the plurality of contacts resides within at least one of the plurality of vias; and
wherein the conductive socket substrate has a thickness defined between the conductive socket first surface and the conductive socket second surface and wherein at least one of the plurality of insulative insert projections has a height less than the conductive socket substrate thickness defining a recess, and further comprising a second conductive material disposed within the recess to form an electrical connection between one of the contacts and the conductive socket substrate.

2. The microelectronic socket of claim 1 , wherein the insulative insert base portion second surface contacts the conductive socket substrate first surface.

3. The microelectronic socket of claim 1 , wherein at least one of the plurality of contacts is in electrical contact with the conductive socket substrate.

4. The microelectronic socket of claim 1 , wherein one of the plurality of vias includes a slotted portion which provides an opening between the slotted portion and the insulative insert second surface, and further comprising a first conductive material disposed within the slotted portion to form a electrical connect between one of the contacts and the conductive socket substrate.

5. The microelectronic socket of claim 1 , wherein at least one of the plurality of insulative insert projections has a height substantially equal to the conductive socket substrate thickness.

6. The microelectronic socket of claim 1 , further including a plurality of interconnects, wherein each of the plurality of interconnects is attached to a corresponding contact.

7. The microelectronic socket of claim 1 , wherein the at least one contact comprises a cantilever contact.

8. The microelectronic socket of claim 7 , wherein the cantilever contact comprises a contact body disposed within the via of the at least one insulative insert projection and a spring cantilever portion extending over the insulative insert base portion first surface.

9. A method of fabricating a microelectronic socket, comprising:
forming a conductive socket substrate comprising forming a plurality of openings in non-conductive substrate and plating a conductive material on the non-conductive substrate, such that the conductive socket has a first surface, a second surface, and a plurality of openings extending from the conductive socket substrate first surface to the conductive socket second surface;
forming an insulative insert comprising a base portion having a first surface and a second surface, and a plurality of projections extending from the insulative insert base portion second surface;
forming a plurality of vias, wherein at least one of the plurality of vias extends from the insulative base portion first surface through one of the plurality of insulative insert projections;
mating the insulative insert with the conductive socket substrate such that each of the plurality of insulative insert projections resides within a corresponding conductive socket substrate opening;
disposing at least one of a plurality of contacts within at least one of the plurality of vias; and
wherein forming the conductive socket substrate comprises forming the conductive socket substrate having a thickness defined between the conductive socket first surface and the conductive socket second surface, and wherein forming the plurality of insulative insert projections comprises forming at least one of the plurality of insulative insert projections having a height less than the conductive socket substrate thickness defining a recess, and further comprising disposing a second conductive material within the recess to form an electrical connection between one of the contacts and the conductive socket substrate.

10. The method of claim 9 , further including disposing at least one of the plurality of contacts such that it is in electrical contact with the conductive socket substrate.

11. The method of claim 9 , wherein forming the plurality of vias comprises forming one of the plurality of vias to include a slotted portion which provides an opening between the slotted portion and the insulative insert second surface, and further comprising disposing a first conductive material within the slotted portion to form an electrical connection between one of the contacts and the conductive socket substrate.

12. A computing device, comprising:
a board;
a microelectronic socket attached to the board;
a microelectronic device biased to the microelectronic socket; and
wherein the microelectronic socket comprises:
a conductive socket substrate having a first surface, a second surface, and a plurality of openings extending from the conductive socket substrate first surface to the conductive socket second surface, wherein the conductive socket substrate comprises a non-conductive core and a conductive material on an exterior surface of the non-conductive core;
an insulative insert comprising a base portion having a first surface and a second surface, and a plurality of projections extending from the insulative insert base portion second surface, wherein the insulative insert is mated with the conductive socket substrate such that each of the plurality of insulative insert projections resides within a corresponding conductive socket substrate opening;
a plurality of vias, wherein at least one of the plurality of vias extends from the insulative base portion first surface through one of the plurality of insulative insert projections;
a plurality of contacts, wherein at least one of the plurality of contacts resides within at least one of the plurality of vias;
wherein the conductive socket substrate has a thickness defined between the conductive socket first surface and the conductive socket second surface and wherein at least one of the plurality of insulative insert projections has a height less than the conductive socket substrate thickness defining a recess, and further comprising a second conductive material disposed within the recess to form an electrical connection between one of the contacts and the conductive socket substrate.

13. The computing device of claim 12 , wherein the insulative insert base portion second surface contacts the conductive socket substrate first surface.

14. The computing device of claim 12 , wherein at least one of the plurality of contacts is in electrical contact with the conductive socket substrate.

15. The computing device of claim 12 , wherein one of the plurality of vias includes a slotted portion which provides an opening between the slotted portion and the insulative inse

Assignees

• Heppner Joshua D
• Zhang Zhichao
• Nekkanty Srikant
• Garcia Michael
• Intel Corp

Inventors

• Heppner Joshua D
• Zhang Zhichao
• Nekkanty Srikant
• Garcia Michael

Classifications

• H05K7/1069 Primary

  with spring contact pieces · CPC title

• H05K1/184

  associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title

• H05K2201/09545

  Plated through-holes or blind vias without lands · CPC title

• H05K2201/10189

  Non-printed connector · CPC title

• Y10T29/49222

  forming array of contacts or terminals · CPC title