Socket for semiconductor component, printed circuit board unit, and information processing apparatus

Patent metadata

Field	Value
Publication number	US-9474147-B2
Application number	US-201514684470-A
Country	US
Kind code	B2
Filing date	Apr 13, 2015
Priority date	Jun 10, 2014
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.

First claim

What is claimed is:

1. A socket for a semiconductor component comprising:
a plate-shaped insulator having a first main surface and a second main surface, where the first main surface and the second main surface being a top surface and a bottom surface of the insulator, and a through hole being formed in the insulator;
a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board; and
a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.

2. The socket for the semiconductor component according to claim 1 , wherein the shield includes:
a first shield plate buried in the insulator from the first main surface, the first shield plate including the first contact; and
a second shield plate buried in the insulator from the second main surface, the second shield plate including the second contact.

3. The socket for the semiconductor component according to claim 2 , wherein the first shield plate and the second shield plate are parallel to each other, a portion of the first shield plate is bent to be a bent portion directed toward the second shield plate, so that the terminal is surrounded by the first shield plate, the second shield plate, and the bent portion.

4. The socket for the semiconductor component according to claim 2 , wherein the first contact is bent to be directed in a normal direction of the first shield plate, and the second contact is bent to be directed in a normal direction of the second shield plate.

5. The socket for the semiconductor component according to claim 1 , wherein a solder bump is fixed to at least one of the first contact and the second contact.

6. The socket for the semiconductor component according to claim 1 , wherein
the shield is formed of a plurality of shield plates buried in the insulator, and
a portion of the shield plate is bent to be a bent portion, and the shield plates adjacent to each other are connected with the bent portion.

7. The socket for the semiconductor component according to claim 1 , wherein the number of the terminals is two, and each of the terminals is supplied with a differential signal.

8. A printed circuit board unit comprising:
a printed circuit board; and
a socket connected to the printed circuit board, wherein the socket includes:
a plate-shaped insulator having a first main surface and a second main surface, where the first main surface and the second main surface being a top surface and a bottom surface of the insulator, and a through hole being formed in the insulator;
a terminal inserted in the through hole, the terminal having an end connected to a signal electrode of the printed circuit board; and
a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and a second contact protruding from the second main surface and connected to a ground electrode of the printed circuit board.

9. An information processing apparatus comprising:
a printed circuit board;
a semiconductor component; and
a socket connected to the printed circuit board, the semiconductor component being attached to the socket wherein the socket includes:
a plate-shaped insulator having a first main surface and a second main surface, where the first main surface and the second main surface being a top surface and a bottom surface of the insulator, and a through hole being formed in the insulator;
a terminal inserted in the through hole, the terminal having one end connected to a signal electrode of the semiconductor component and having another end connected to a signal electrode of the printed circuit board; and
a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and connected to a ground electrode of the semiconductor component and a second contact protruding from the second main surface and connected to a ground electrode of the printed circuit board.

Assignees

• Fujitsu Ltd

Inventors

• Masuda Yasushi
• Tamura Akira
• Morita Yoshihiro
• Ohsawa Satoshi

Classifications

• H01R12/7082

  Coupling device supported only by cooperation with PCB · CPC title

• H01R12/52

  connecting to other rigid printed circuits or like structures · CPC title

• H01R13/6588

  with through openings for individual contacts · CPC title

• H05K1/0216 Primary

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H01R9/096

  Electricity · mapped topic