Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate
US-9491881-B2 · Nov 8, 2016 · US
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Heppner Joshua D patents
Heppner Joshua D holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Nov 3, 2015 |
| Latest publication | Nov 8, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate
US-9491881-B2 · Nov 8, 2016 · US
Electronic assemblies with scalable clip-type connectors
US-9325087-B2 · Apr 26, 2016 · US
Shielded sockets for microprocessors and fabrication thereof by overmolding and plating
US-9178328-B2 · Nov 3, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P95/00 | 1 |
| H10W72/071 | 1 |
| H10W95/00 | 1 |
| H01R13/405 | 1 |
| H01R12/716 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Cross-Sectional Technologies | 2 |