Multi-array bottom-side connector using spring bias

Patent metadata

Field	Value
Publication number	US-9490560-B2
Application number	US-201414576735-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Dec 19, 2014
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.

First claim

What is claimed is:

1. An integrated circuit connector comprising:
a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package;
a cable connector to electrically connect the resilient connectors to a cable;
a base plate having a bottom surface to press against a system board, and a top surface opposite the bottom surface; and
plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.

2. The connector of claim 1 , wherein the base plate bottom surface presses against the circuit board through a direct physical connection to a top surface of the circuit board.

3. The connector of claim 1 , wherein the base plate has alignment features to align with a particular position on the circuit board.

4. The connector of claim 1 , wherein the spring members comprise coil springs mounted at each of four corners of the top surface of the base plate and contacting the bottom surface of the connector housing.

5. The connector of claim 1 , wherein the spring members comprise leaf springs formed in the base plate and extending from the base plate to the bottom surface of the connector housing.

6. The connector of claim 1 , wherein the cable connector is attached to the bottom surface of the connector housing between the spring members.

7. The connector of claim 1 , wherein the resilient connectors comprise a land grid array.

8. The connector of claim 1 , wherein the connector housing has mating features to align the connector housing with a socket for the integrated circuit package.

9. The connector of claim 1 , wherein the connector housing has mating features to align the connector with a bolster plate attached to the circuit board and to a socket for the integrated circuit package.

10. The connector of claim 1 , wherein the connector housing comprises side walls on each of two sides of the connector housing connectors, wherein the spring members comprise coil springs extending through the side walls on the two sides.

11. The connector of claim 10 , further comprising a vertical groove in each side wall to serve as a mechanical mating feature to align with a corresponding feature on a socket.

12. The connector of claim 11 , wherein the mechanical mating feature aligns the connector with the socket and substantially eliminates horizontal movement of the connector.

13. A computing device comprising:
a motherboard;
a memory attached to the motherboard;
a socket attached to the motherboard;
a packaged processor attached to the socket; and
a connector attached to the socket, the connector including a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against the motherboard, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the motherboard and to press the connector housing connectors against the package.

14. The computing device of claim 13 , wherein the spring members comprise coil springs mounted at each of four corners of the top surface of the base plate and contacting the bottom surface of the connector housing.

15. The computing device of claim 13 , wherein the spring members comprise leaf springs formed in the base plate and extending from the base plate to the bottom surface of the connector housing.

16. The computing device of claim 13 , wherein the connector housing comprises side walls on each of two sides of the connector housing connectors, wherein the spring members comprise coil springs extending through the side walls on the two sides.

17. The computing device of claim 13 , wherein the connector is fastened to the circuit board using screws.

18. A method comprising:
attaching a socket to a circuit board, the socket configured to hold an integrated circuit die package;
attaching a connector to the socket, the connector having a housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, the connector having a cable connector to electrically connect the resilient connectors to a cable, the connector having a base plate having a bottom surface to press against the circuit board, and a top surface opposite the bottom surface, and the connector having a plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the circuit board and to press the connector housing connectors against the package; and
placing an integrated circuit die package in the socket, so that a first contact area of the package connects to the socket and a second contact area of the package connects to the connector.

19. The method of claim 18 , wherein placing comprises pressing the spring members against the circuit board so that the base plate bottom surface presses against the circuit board to ensure a connection between the second contact area and the connector.

20. The method of claim 18 , wherein attaching the connector comprises sliding a vertical groove on each of two side walls of the connector housing across a mating finger on the socket to align the groove with a corresponding finger and substantially eliminate horizontal movement of the connector.

Assignees

• Intel Corp

Inventors

• Chawla Gaurav
• Llapitan David J
• Smalley Jeffory L
• Aulakh Tejinder Pal
• Krithivasan Vijaykumar
• Tran Donald T

Classifications

• H05K7/1092

  with built-in components, e.g. intelligent sockets · CPC title

• H01R43/205

  with a panel or printed circuit board · CPC title

• G06F1/18

  Packaging or power distribution · CPC title

• H01R12/79 Primary

  connecting to rigid printed circuits or like structures · CPC title

• H05K7/1069 Primary

  with spring contact pieces · CPC title