Method and apparatus for forming coating layer with nano multi-layer

Patent metadata

Field	Value
Publication number	US-9422618-B2
Application number	US-201213529165-A
Country	US
Kind code	B2
Filing date	Jun 21, 2012
Priority date	Nov 30, 2011
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Disclosed is a method and apparatus for forming a coating layer using a physical vapor deposition apparatus equipped with a sputtering apparatus and an arc ion plating apparatus, comprising: a first coating step of forming a Mo coating layer on a base material using a the sputtering apparatus and a Mo target and Ar gas; a nitrating step of forming a nitride film forming condition using an arc ion plating apparatus and Ar gas and N 2 gas; a second coating step of forming a nano composite coating layer of Cr—Mo—N using the Mo target and Ar gas of the sputtering apparatus and the Ar gas, N 2 gas and a Cr source of the arc ion plating apparatus at the same time; and a multi-coating step of forming a multi-layer having alternating Cr—Mo—N nano composite coating layers and Mo coating layers by revolving the base material around a central pivot.

First claim

What is claimed is:

1. A method for forming a coating layer with a nano multi-layer, comprising steps of:
a first coating step of forming a Mo coating layer on a base material using a sputtering apparatus and a Mo target and Ar gas;
a nitrating step of providing a nitride film forming condition using an arc ion plating apparatus and an Ar gas and N 2 gas;
a second coating step of forming a nano composite coating layer comprising Cr—Mo—N using the Mo target and Ar gas of the sputtering apparatus and the Ar gas, N 2 gas and a Cr source of the arc ion plating apparatus at the same time; and
a multi-coating step of coating a multi-layer having alternating layers of a Cr—Mo—N nano composite coating layer and a Mo coating layer by revolving the base material around a central pivot, wherein a bias voltage is applied to the base material in a range of about −250 to −150 V such that a main growth face of the Cr—Mo—N is controlled in a direction to improve corrosion resistance and electrical conductivity of the coating layer,
wherein the main growth face of the Cr—Mo—N is [220], and the main growth face of the Cr—Mo—N corresponds to a growing surface having the highest distribution as a same type crystal among all crystals constituting the Cr—Mo—N, and
wherein the corrosion resistance and the electrical conductivity of the coating layer are improved when the bias voltage is applied to the base material in the range of about −250 to −150 V.

2. The method of claim 1 , wherein in the multi-coating step, an angle between central axes of the sputtering apparatus and arc ion plating apparatus is maintained at about 60-120°.

3. The method of claim 1 , wherein in the multi-coating step, a flow rate of the Ar gas of the sputtering apparatus is controlled to about 60 sccm, and flow rates of the Ar gas and N 2 gas of the ion plating apparatus are controlled to about 20 sccm and about 40˜100 sccm, respectively.

4. The method of claim 1 , wherein in the multi-coating step, a power of the sputtering apparatus is controlled to about 50˜1000 W.

5. The method of claim 1 , wherein in the multi-coating step is carried out while maintaining the temperature in the chamber at about 150˜350° C.

Assignees

• Lyo In Woong
• Hong Woong Pyo
• Choi Kwang Hoon
• Kang Hyuk
• Park Sang Jin
• Oh Yoon Suk
• Hyundai Motor Co Ltd
• Hyundai Steel Co

Inventors

• Lyo In Woong
• Hong Woong Pyo
• Choi Kwang Hoon
• Kang Hyuk
• Park Sang Jin
• Oh Yoon Suk

Classifications

• C23C14/586

  Nitriding · CPC title

• C23C14/54

  Controlling or regulating the coating process · CPC title

• C23C14/0021 Primary

  Reactive sputtering or evaporation · CPC title

• C23C28/34

  including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates · CPC title

• C23C14/345

  using substrate bias · CPC title