Film forming apparatus and film forming method
US-12428721-B2 · Sep 30, 2025 · US
Nitriding
Nitriding · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C14/586 |
| Official title | {Nitriding} |
| Display label | Nitriding |
| Total patents | 52 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 5 |
| 2017 | 5 |
| 2018 | 6 |
| 2019 | 4 |
| 2020 | 2 |
| 2021 | 5 |
| 2022 | 2 |
| 2023 | 7 |
| 2024 | 7 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Film formation apparatus
US-12385125-B2 · Aug 12, 2025 · US
Film deposition apparatus and film deposition method
US-12359302-B2 · Jul 15, 2025 · US
Process for pre-lithiation and equipment for implementing the same
US-2025167197-A1 · May 22, 2025 · US
Laminate, electron source and electronic device containing laminate, and production method and cleaning method for laminate
US-12237141-B2 · Feb 25, 2025 · US
Laminate, electron source and electronic device containing laminate, and production method and cleaning method for laminate
US-2024395494-A1 · Nov 28, 2024 · US
External part for watches or jewellery comprising a coating of saturated intrinsic colour and method for manufacturing said external part
US-2024358127-A1 · Oct 31, 2024 · US
Guiding member, mechanical system comprising such a guiding member, and method for producing such a guiding member
US-12098744-B2 · Sep 24, 2024 · US
Dielectric thin film, capacitor element, and electronic circuit board
US-11999616-B2 · Jun 4, 2024 · US
Integrated pvd tungsten liner and seamless cvd tungsten fill
US-2024087955-A1 · Mar 14, 2024 · US
Film deposition apparatus and film deposition method
US-2024060170-A1 · Feb 22, 2024 · US
Method of depositing condensable material onto a surface of a substrate
US-2024014033-A1 · Jan 11, 2024 · US
Film formation apparatus
US-2023407458-A1 · Dec 21, 2023 · US
Methods for seamless gap filling of dielectric material
US-11830728-B2 · Nov 28, 2023 · US
Film formation apparatus and film formation method
US-2023366077-A1 · Nov 16, 2023 · US
Feni ordered alloy structural body and method for manufacturing the same
US-2023368952-A1 · Nov 16, 2023 · US
Part for a motor vehicle comprising an opacification coating, associated manufacturing method and luminous device comprising said part
US-2023332756-A1 · Oct 19, 2023 · US
Methods for seamless gap filling of dielectric material
US-2023113965-A1 · Apr 13, 2023 · US
Film forming apparatus and film forming method
US-2023097539-A1 · Mar 30, 2023 · US
Guiding Member, Mechanical System Comprising Such A Guiding Member, And Method For Producing Such A Guiding Member
US-2022220999-A1 · Jul 14, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C14/586?
- CPC C23C14/586 is the Cooperative Patent Classification code for “Nitriding.”
- How many patents are filed under CPC C23C14/586 (Nitriding)?
- Our database includes 52 publications tagged with this CPC code.
- Is patent activity under CPC C23C14/586 growing?
- Publication counts under this code: 7 in 2024 vs 5 in 2025 (latest complete years).