Top gated method for manufacturing a data carrier

Patent metadata

Field	Value
Publication number	US-9406014-B2
Application number	US-201214126595-A
Country	US
Kind code	B2
Filing date	Jun 14, 2012
Priority date	Jun 17, 2011
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A method for manufacturing a portable data carrier includes the steps of: providing a carrier band having an upper side and a lower side disposed opposite the upper side including a contact field formed with at least one contact area; arranging a semiconductor circuit on the lower side of the carrier band and electroconductively connected with the corresponding contact area; and carrying out an injection molding process on the lower side a potting compound formed around the semiconductor circuit and having outer dimensions according to a portable data carrier standard specification. An injection channel for injecting the potting compound is arranged on a side of the potting compound mold parallel to the lower side, and after the injection of the potting compound a depression remains in the finished data carrier due to the injection channel. A portable data carrier includes the features and is used as a subscriber identity module.

First claim

The invention claimed is:

1. A method for manufacturing a portable data carrier having the method steps of:
making available a carrier band having an upper side and a lower side disposed opposite the upper side, wherein on the upper side a contact field is formed having at least one contact area;
arranging a semiconductor circuit on the lower side of the carrier band, wherein the semiconductor circuit is electroconductively connected with the corresponding contact area; and
executing a top gated injection molding process in that on the lower side a first potting compound is formed around the semiconductor circuit, wherein said first potting compound has the outer dimensions in accordance with a predetermined specification of a portable data carrier,
wherein the semiconductor circuit is encapsulated by a second potting compound before the injection molding process and wherein the first potting compound has improved flow properties from the second potting compound that provides ease in forming a depression and achieving a smaller corner radius and a steeper flank angle,
wherein after the injection of the potting compound a depression remains in the finished data carrier and is centered on a lower side of the data carrier body.

2. The method according to claim 1 , wherein the data carrier is a subscriber identity module for use in a terminal as intended, and the depression is provided to make the handling of the subscriber identity module easier for a user of the subscriber identity module upon incorporation in the terminal and/or upon removal from the terminal.

3. The method according to claim 1 , wherein the injection channel for injecting the first potting compound is centrally located on the side of the potting compound mold that is parallel to the lower side producing the depression.

4. The method according to claim 1 , wherein uneven areas are contained in an inner region of the depression.

5. The method according to claim 1 , wherein the carrier band is pre-punched in such a fashion that upon singling the data carriers less carrier band material is severed.

6. The method according to claim 1 , wherein the data carrier is electrically personalized in a personalization unit before a singling step individualizing the data carrier.

7. The method according to claim 1 , wherein the data carrier is optically personalized before a singling step.

8. The method according to claim 1 , wherein the data carrier is singled by separating the portion of the carrier band that is connected with the potting compound from the rest of the carrier band.

9. The method of claim 1 , wherein the depression is a central groove with uneven areas within the groove, the groove sized for a fingernail or corresponding object to remove the data carrier.

10. A portable data carrier for contact-type data exchange with a terminal, comprising:
a carrier band having an upper side and a lower side disposed opposite the upper side, wherein on the upper side a contact field is formed having at least one contact area;
a semiconductor circuit on the lower side, wherein the semiconductor circuit is electroconductively connected with the at least one contact area;
a data carrier body of a first potting compound material, wherein the first potting compound surrounds the semiconductor circuit and the potting compound has the outer dimensions according to a predetermined specification of a portable data carrier;
wherein the semiconductor circuit is encapsulated by a second potting compound before the injection molding process and wherein the first potting compound has improved flow properties from the second potting compound that provides ease in forming a depression and achieving a smaller corner radius and a steeper flank angle,
wherein the finished data carrier body has a depression centrally located on a side that is parallel to the lower side.

11. The portable data carrier according to claim 10 , wherein the depression has uneven areas in an inner region, wherein, despite the uneven areas, the data carrier body does not exceed the maximum height of the data carrier body described according to the predetermined specification.

12. The portable data carrier according to claim 10 , wherein the first potting compound is of a material that differs from the second potting compound.

13. The portable data carrier according to claim 12 , wherein the corner radius of the second potting compound is larger than the corner radius of the first potting compound.

14. The portable data carrier according to claim 12 , wherein the flank angle of the second potting compound is larger than the flank angle of the first potting compound.

15. The employment of a data carrier according to claim 10 as a subscriber identity module for use in a terminal as intended.

Assignees

• Buttner Bernhard
• Tarantino Thomas
• Griesmeier Robert
• Giesecke & Devrient Gmbh

Inventors

• Buttner Bernhard
• Tarantino Thomas
• Griesmeier Robert

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title