Resin-molded electronic device with disconnect prevention

Patent metadata

Field	Value
Publication number	US-10618206-B2
Application number	US-201716464704-A
Country	US
Kind code	B2
Filing date	Nov 16, 2017
Priority date	Feb 27, 2017
Publication date	Apr 14, 2020
Grant date	Apr 14, 2020

Abstract

An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. A thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.

First claim

The invention claimed is:

1. A method for manufacturing an electronic device including
an electronic component having electrodes,
a resin molded body embedding the electronic component such that the electrodes are exposed,
a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and
wires formed on the resin molded body and the resin member and connected to the electrodes,
the method comprising:
a first step of arranging the electronic component on a sheet having a surface on which an adhesive liquid layer is applied, and forming a wetting portion around the electronic component by wetting of the adhesive liquid layer along side surfaces of the electronic component;
a second step of curing the wetting portion;
a third step of injecting a first resin material onto the surface of the sheet on which the electronic component is arranged, and thereby molding the resin molded body embedding the electronic component;
a fourth step of peeling the sheet and the wetting portion from the resin molded body, and thereby forming a groove conforming to a shape of the wetting portion around the electronic component in the resin molded body;
a fifth step of supplying a second resin material to fill the groove, curing the second resin material, and forming the resin member; and
a sixth step of forming the wires on the resin molded body and the resin member.

2. An electronic device comprising:
an electronic component having electrodes;
a resin molded body embedding the electronic component such that the electrodes are exposed;
a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body; and
wires formed on the resin molded body and the resin member and connected to the electrodes, wherein
a thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.

3. The method for manufacturing the electronic device according to claim 1 , wherein
the second resin material contains a volatile substance,
voids are formed inside the resin member by volatilizing the volatile substance when curing the second resin material in the fifth step, and
electrically conducting paths connected to the wires and the electrodes are formed inside the resin member by infiltrating an electrically conductive material constituting the wires into the voids in the sixth step.

4. An electronic device comprising:
an electronic component having electrodes;
a resin molded body embedding the electronic component such that the electrodes are exposed;
a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body; and
wires formed on the resin molded body and the resin member and connected to the electrodes, wherein
the resin member has voids therein, and
the electronic device further comprises electrically conducting paths formed within the voids and connected to the wires and the electrodes.

5. A method for manufacturing an electronic device including
an electronic component having electrodes,
a resin molded body embedding the electronic component such that the electrodes are exposed,
a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and
wires formed on the resin molded body and the resin member and connected to the electrodes,
the method comprising:
a first step of arranging the electronic component on a sheet having a surface on which an adhesive liquid layer is applied, and forming a wetting portion around the electronic component by wetting of the adhesive liquid layer along side surfaces of the electronic component;
a second step of curing the wetting portion and forming the resin member;
a third step of injecting a resin material onto the surface of the sheet on which the electronic component is arranged and molding the resin molded body, after forming the resin member;
a fourth step of peeling the sheet from the resin molded body such that the resin member remains between the resin molded body and the electronic component; and
a fifth step of forming the wires on the resin molded body and the resin member.

6. The method for manufacturing the electronic device according to claim 5 , wherein
the adhesive liquid layer contains a volatile substance,
voids are formed inside the resin member by volatilizing the volatile substance when curing the wetting portion in the second step, and
electrically conducting paths connected to the wires and the electrodes are formed inside the resin member by infiltrating an electrically conductive material constituting the wires into the voids in the fifth step.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Kawai Wakahiro

Classifications

• B29C45/14827

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• H01C17/006

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• H01G13/003

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• B29C2045/1486

  Details, accessories and auxiliary operations · CPC title

• H01G2/103

  Sealings, e.g. for lead-in wires; Covers · CPC title