Apparatus for processing semiconductor wafers, in particular for carrying out a polymers removal process step

Patent metadata

Field	Value
Publication number	US-9385011-B2
Application number	US-201213440852-A
Country	US
Kind code	B2
Filing date	Apr 5, 2012
Priority date	Apr 15, 2011
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

An apparatus for processing semiconductor wafers includes at least a wet bench and an automatic handling system of a wafer carrier removably connected thereto. The wet bench includes a first processing tank, a second processing tank and a third processing tank, separated from one another, each processing tank being dedicated to a different chemical, as well as a special cleaning and drying tank for processing the automatic handling system when the wafer carrier has been removed.

First claim

The invention claimed is:

1. An apparatus for processing semiconductor wafers, comprising:
an automatic handling system including a connector coupled to a support, the support housing a wafer carrier carrying semiconductor wafers, the automatic handling system being configured to convey the support housing the wafer carrier;
a wet bench including a first processing tank, a second processing tank and a third processing tank, separated from one another, and a cleaning and drying tank, the first, second, and third processing tanks being configured to store first, second, and third chemicals, respectively, for processing wafers in the wafer carrier, the cleaning and drying tank being configured to receive and process the connector and the support; and
a pair of tracks positioned inside said support and configured to enable said wafer carrier to slide along the pair of tracks.

2. An apparatus according to claim 1 , wherein said cleaning and drying tank is equipped with nozzles configured to provide a cleaning fluid and a drying blow.

3. An apparatus according to claim 2 , wherein said nozzles of said cleaning and drying tank are configured to provide a flow of de-ionized water and a blow of nitrogen.

4. An apparatus according to claim 1 , wherein said first, second and third processing tanks are provided with respective automatic lids configured to automatically close and open said first, second and third processing tanks during processing of the semiconductor wafers in the wafer carrier.

5. An apparatus according to claim 1 , wherein said wet bench further comprises a protective cover, which protects an operator of the apparatus, during processing of the semiconductor wafers, said protective cover being preferably at least partially transparent.

6. An apparatus according to claim 5 , wherein said protective cover is provided with an interlock which prevents any opening thereof during processing of the semiconductor wafers.

7. An apparatus according to claim 1 , wherein said first processing tank is filled with de-ionized water, said second processing tank is filled with isopropyl alcohol, and said third processing tank is filled with a hydroxylamine-based solvent, the apparatus being configured to carry out a polymer removal process.

8. An apparatus according to claim 7 , wherein said wet bench further comprises a separation bulkhead which isolates the third processing tank from the first and second processing tanks.

9. An apparatus according to claim 1 , wherein said first, second and third processing tanks, are provided with respective drains for chemicals stored in the first, second and third processing tanks.

10. An apparatus according to claim 1 , wherein said first, second and third processing tanks include respective inlets configured to receive the first, second, and third chemicals, respectively, and respective spray nozzles to fill the respective tank with the respective chemical.

11. An apparatus according to claim 10 , further comprising:
a first buffer tank that includes a charge buffer tank configured to charge the second processing tank with isopropyl alcohol and a discharge buffer tank configured to recover said isopropyl alcohol; and
a first filtering group configured to couple said first buffer tank to said inlets and spray nozzles of said second processing tank.

12. An apparatus according to claim 11 , wherein said the second processing tank includes a recirculating mechanism configured to recirculate the isopropyl alcohol.

13. An apparatus according to claim 11 , further comprising:
a second buffer tank configured to charge and discharge the third processing tank with a hydroxylamine-based solvent; and
a second filtering group configured to couple said second buffer tank to said inlets and spray nozzles of said third processing tank.

14. An apparatus according to claim 13 , wherein said second buffer tank comprises an indirect heater configured to heat the hydroxylamine-based solvent to a desired processing temperature.

15. An apparatus according to claim 1 , wherein said first processing tank comprises a rinse tank with an overflow mechanism in order to rinse the semiconductor wafers with de-ionized water.

16. An apparatus according to claim 1 , comprising an automatic chemical distribution system configured to handle containers of the third chemical and automatically charge the third chemical into said third processing tank.

Assignees

• Tenaglia Dario
• Cali Sebastiano
• St Microelectronics Srl

Inventors

• Tenaglia Dario
• Cali Sebastiano

Classifications

• H10P72/0426

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/32

  between different workstations · CPC title

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title