Apparatus and method for improved darkspace gap design in RF sputtering chamber

Patent metadata

Field	Value
Publication number	US-9373485-B2
Application number	US-201514618416-A
Country	US
Kind code	B2
Filing date	Feb 10, 2015
Priority date	Mar 12, 2010
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

Improved designs of target assemblies and darkspace shields are disclosed. Methods of improving darkspace gap in sputtering chambers and sputtering chambers having an improved darkspace gap are also disclosed. Disclosed is a target assembly having a substantially coplanar backing plate and a target are vertically spaced from the darkspace shield.

First claim

What is claimed is:

1. A method for manufacturing a target assembly for use in an RF sputtering chamber comprising:
providing a backing plate having a back surface, a front peripheral face defining an inner peripheral edge and a recessed area having a shape bounded by the inner peripheral edge;
providing a target having substantially the same shape as the recessed area, the target having an inner surface, a sputterable target surface and an outer peripheral edge; and
joining the inner surface of the target to the inner peripheral face of the backing plate so that the sputterable target surface is substantially coplanar with the outer peripheral face, and after joining a vertical darkspace gap comprising a vertical space is formed between the outer peripheral edge of the target and the inner peripheral edge of the recessed area of the backing plate.

2. A method for manufacturing a target assembly for use in an RF sputtering chamber comprising:
installing a target comprising a sputterable target surface, a top surface, and an outer peripheral edge into a recess of a backing plate, wherein the backing plate comprises an outer peripheral front face, an inner peripheral face, an inner peripheral edge, and a top surface, wherein the recessed area is bounded by the inner peripheral edge and the inner peripheral face, and wherein the sputterable target surface and the outer peripheral front face lie in the same plane when installed, and wherein a completed target assembly comprises a vertical space between the outer peripheral edge of the target and the inner peripheral edge of the recessed area in the backing plate.

3. The method of claim 2 , which further comprises joining the outer peripheral edge of the target to the inner peripheral face of the backing plate by welding, brazing, mechanical fastening, or a combination thereof.

4. The method of claim 2 , wherein the recess of the backing plate completely surrounds the top surface and the outer peripheral edge of the target except for the sputterable target surface.

5. The method of claim 2 , wherein the backing plate is fabricated from an electrically-conductive metal.

6. The method of claim 2 , wherein the target has a shape substantially the same as a shape of the recessed area.

7. A method for manufacturing a target assembly for use in an RF sputtering chamber comprising:
fabricating a unitary backing plate comprising an outer peripheral front face and a recessed area, wherein the recessed area is bounded by an inner peripheral edge and an inner peripheral face;
installing a target comprising a sputterable target surface, a top surface, and an outer peripheral edge into the recessed area of the backing plate, wherein the target has a shape substantially the same as a shape of the recessed area, the target sized to form a vertical darkspace gap between the outer peripheral edge of the target and the inner peripheral edge of the recessed area in the unitary backing plate in a completed target assembly; and
joining the outer peripheral edge of the target to the inner peripheral face of the backing plate by welding, brazing, mechanical fastening, or a combination thereof.

8. The method of claim 7 , wherein the sputterable target surface and the outer peripheral front face of the unitary backing plate lie in the same plane.

Assignees

• Applied Materials Inc

Inventors

• Forster John C
• Tang Xianmin

Classifications

• C23C14/3407

  Cathode assembly for sputtering apparatus, e.g. Target · CPC title

• B23K31/02

  relating to soldering or welding · CPC title

• Y10T29/49947

  by applying separate fastener · CPC title

• H01J2237/332

  Coating · CPC title

• Y10T29/49826

  Assembling or joining · CPC title