Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
US9346188B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9346188-B2 |
| Application number | US-201313749804-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 25, 2013 |
| Priority date | Feb 9, 2012 |
| Publication date | May 24, 2016 |
| Grant date | May 24, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A method and apparatus are used to simultaneously slice a multiplicity of slices from a workpiece. The workpiece is held with a feed device so as to position an axis of the workpiece parallel to axes of wire guide rolls of a wire saw and is moved from above through a web of the wire saw. A slurry is supplied as abrasive to wire sections of the web while the wire sections are moved relative to the workpiece. The relative movement guides the wire sections from an entry side to an exit side through the workpiece. A coolant is sprayed from the side and below through nozzles into slicing gaps in the workpiece. The nozzles are arranged below the web parallel to the axes of the wire guide rolls. The coolant is sprayed into the slicing gaps through a nozzle situated opposite the entry side of the respective wire section.
Opening claim text (preview).
What is claimed is: 1. A method for simultaneously slicing a multiplicity of slices from a workpiece, the method comprising: holding the workpiece with a feed device so as to position an axis of the workpiece parallel to axes of wire guide rolls of a wire saw; moving the workpiece, using the feed device, perpendicularly from above through a web of the wire saw, the web being formed from a multiplicity of wire sections running parallel to one another and in one plane; rotating the wire guide rolls while alternately changing the direction of rotation, so that the relative movement guides the wire sections from an entry side to an exit side through the workpiece, the entry side and exit side alternating with the change in direction of rotation; supplying a slurry of hard substances in a carrier liquid as abrasive to the wire sections while the wire sections undergo the relative movement; and spraying a coolant from the side and from below into slicing gaps that arise during the relative movement of the workpiece through the web, wherein the coolant is sprayed through nozzles arranged below the web and parallel to the axes of the wire guide rolls, and wherein the coolant is sprayed into the slicing gaps alternating with the change of direction of rotation only through a nozzle situated opposite the entry side of the respective wire section. 2. A method for simultaneously slicing a multiplicity of slices from a workpiece, the method comprising: holding the workpiece with a feed device so as to position an axis of the workpiece parallel to axes of wire guide rolls of a wire saw; moving the workpiece, using the feed device, perpendicularly from above through a web of the wire saw, the web being formed from a multiplicity of wire sections running parallel to one another and in one plane; rotating the wire guide rolls while alternately changing the direction of rotation, so that the relative movement guides the wire sections from an entry side to an exit side through the workpiece, the entry side and exit side alternating with the change in direction of rotation; supplying a slurry of hard substances in a carrier liquid as abrasive to the wire sections while the wire sections undergo the relative movement; and spraying a coolant from the side and from below into slicing gaps that arise during the relative movement of the workpiece through the web, wherein the coolant is sprayed through nozzles arranged below the web and parallel to the axes of the wire guide rolls, wherein the coolant is sprayed into the slicing gaps alternating with the change of direction of rotation only through a nozzle situated opposite the entry side of the respective wire section, and wherein a further slurry of hard substances in a carrier liquid is used as the coolant. 3. The method as recited in claim 2 , wherein the abrasive used and the coolant used have identical properties with the exception of the temperature. 4. The method as recited in claim 1 , wherein the abrasive used and the coolant used have the same temperature. 5. The method as recited in claim 1 , wherein the abrasive used and the coolant used have different temperatures. 6. The method as recited in claim 1 , wherein the temperature of the coolant is altered during the movement of the workpiece through the web. 7. The method as recited in claim 6 , wherein the temperature of the coolant is altered in a manner dependent on an engagement length of the wire sections in the workpiece. 8. The method as recited in claim 7 , wherein the temperature of the coolant is increased as the wire engagement length increases, and the temperature of the coolant is reduced as the wire engagement length decreases. 9. The method as recited in claim 1 , wherein a volumetric flow rate of the sprayed coolant is kept constant during the movement of the wire sections through the web. 10. The method as recited in claim 1 , wherein a volumetric flow rate of the sprayed coolant is altered during the movement of the wire sections through the web. 11. The method as recited in claim 10 , wherein the volumetric flow rate of the coolant sprayed in is altered in a manner dependent on the wire engagement length in the workpiece. 12. The method as recited in claim 11 , wherein the volumetric flow rate of the coolant sprayed in is increased as the wire engagement length increases, and is reduced as the wire engagement length decreases. 13. The method as recited in claim 1 , wherein the workpiece is a single crystal having a diameter of at least 450 mm.
Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title
Use, recovery or regeneration of abrasive mediums (for grinding and polishing in general B24B57/00) · CPC title
for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work · CPC title
by cutting with wires or closed-loop blades (B28D5/042 takes precedence) · CPC title
Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.