Abrasive article and method of forming
US-2016375514-A1 · Dec 29, 2016 · US
by cutting with wires or closed-loop blades (B28D5/042 takes precedence)
by cutting with wires or closed-loop blades (B28D5/042 takes precedence) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D5/045 |
| Official title | {by cutting with wires or closed-loop blades (B28D5/042 takes precedence)} |
| Display label | by cutting with wires or closed-loop blades (B28D5/042 takes precedence) |
| Total patents | 231 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 31 |
| 2016 | 29 |
| 2017 | 20 |
| 2018 | 29 |
| 2019 | 22 |
| 2020 | 11 |
| 2021 | 12 |
| 2022 | 16 |
| 2023 | 19 |
| 2024 | 17 |
| 2025 | 22 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multi-wire saw
US-2016368069-A1 · Dec 22, 2016 · US
Method of growing group III nitride crystals
US-9518340-B2 · Dec 13, 2016 · US
Silicon carbide substrate, semiconductor device and methods for manufacturing them
US-2016359007-A1 · Dec 8, 2016 · US
Singulation apparatus and method
US-9508570-B2 · Nov 29, 2016 · US
Silicon carbide substrate, semiconductor device and methods for manufacturing them
US-9484416-B2 · Nov 1, 2016 · US
Method for slicing workpiece and workpiece holder
US-2016303765-A1 · Oct 20, 2016 · US
Method for slicing workpiece
US-2016250776-A1 · Sep 1, 2016 · US
Method for resuming a wire sawing process of a workpiece after an unplanned interruption
US-9427888-B2 · Aug 30, 2016 · US
Method and device for wire cutting of a material
US-2016243725-A1 · Aug 25, 2016 · US
Silicon carbide ingot and method for manufacturing silicon carbide substrate
US-2016236375-A1 · Aug 18, 2016 · US
Method of manufacturing silicon carbide substrate
US-2016229086-A1 · Aug 11, 2016 · US
Apparatus and method for processing a substrate
US-2016233129-A1 · Aug 11, 2016 · US
Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method
US-9387548-B2 · Jul 12, 2016 · US
Systems and methods for manufacturing diamond coated wires
US-2016184909-A1 · Jun 30, 2016 · US
Method for slicing ingot and wire saw
US-2016176069-A1 · Jun 23, 2016 · US
Method of manufacturing silicon carbide substrate
US-9346187-B2 · May 24, 2016 · US
Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece
US-9346188-B2 · May 24, 2016 · US
Sample preparation apparatus for direct numerical simulation of rock properties
US-9341549-B2 · May 17, 2016 · US
Method for simultaneously cutting a multiplicity of wafers from a workpiece
US-9333673-B2 · May 10, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B28D5/045?
- CPC B28D5/045 is the Cooperative Patent Classification code for “by cutting with wires or closed-loop blades (B28D5/042 takes precedence).”
- How many patents are filed under CPC B28D5/045 (by cutting with wires or closed-loop blades (B28D5/042 takes precedence))?
- Our database includes 231 publications tagged with this CPC code.
- Is patent activity under CPC B28D5/045 growing?
- Publication counts under this code: 17 in 2024 vs 22 in 2025 (latest complete years).