Semiconductor Sawing Method and System
US-2019389091-A1 · Dec 26, 2019 · US
for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D5/0076 |
| Official title | {for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work} |
| Display label | for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work |
| Total patents | 167 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 12 |
| 2017 | 7 |
| 2018 | 12 |
| 2019 | 27 |
| 2020 | 17 |
| 2021 | 24 |
| 2022 | 13 |
| 2023 | 16 |
| 2024 | 12 |
| 2025 | 17 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Cutting apparatus
US-2019283195-A1 · Sep 19, 2019 · US
Chuck table and processing apparatus including the same
US-2019275700-A1 · Sep 12, 2019 · US
Constant temperature water supply apparatus
US-2019270170-A1 · Sep 5, 2019 · US
Wire saw device and workpiece cutting method
US-10399249-B2 · Sep 3, 2019 · US
Wire sawing apparatus
US-10391673-B2 · Aug 27, 2019 · US
Water temperature setting method for processing apparatus
US-2019255672-A1 · Aug 22, 2019 · US
Ingot slicing apparatus
US-10377056-B2 · Aug 13, 2019 · US
Cutting apparatus and wafer cutting method
US-10354893-B2 · Jul 16, 2019 · US
Ingot clamping device and wire sawing apparatus for slicing ingot having the same
US-2019184603-A1 · Jun 20, 2019 · US
Peeling apparatus
US-2019160708-A1 · May 30, 2019 · US
Method for cutting watch crystals
US-2019113890-A1 · Apr 18, 2019 · US
Stage for cutting substrate and substrate-cutting apparatus
US-10239161-B2 · Mar 26, 2019 · US
Cutting blade mounting mechanism
US-2019084124-A1 · Mar 21, 2019 · US
Cutting apparatus
US-2019076981-A1 · Mar 14, 2019 · US
Slicing method and a slicing apparatus for an ingot
US-2019070751-A1 · Mar 7, 2019 · US
Cutting blade and mounting mechanism for cutting blade
US-2019054596-A1 · Feb 21, 2019 · US
Cutting apparatus and wafer processing method
US-2019051532-A1 · Feb 14, 2019 · US
Cutting apparatus
US-10183419-B2 · Jan 22, 2019 · US
Blade mounting and dismounting jig, blade mounting and dismounting method, blade extracting method, and cutting apparatus
US-2019009379-A1 · Jan 10, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B28D5/0076?
- CPC B28D5/0076 is the Cooperative Patent Classification code for “for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work.”
- How many patents are filed under CPC B28D5/0076 (for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work)?
- Our database includes 167 publications tagged with this CPC code.
- Is patent activity under CPC B28D5/0076 growing?
- Publication counts under this code: 12 in 2024 vs 17 in 2025 (latest complete years).