Substrate bonding apparatus and substrate bonding method

Patent metadata

Field	Value
Publication number	US-9299620-B2
Application number	US-201313887496-A
Country	US
Kind code	B2
Filing date	May 6, 2013
Priority date	Aug 10, 2007
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

A substrate bonding apparatus is equipped with a first table that holds one wafer of two wafers, a stage device that holds the other wafer in an orientation capable of opposing to the one wafer and that is movable at least within an XY plane, an interferometer system that measures positional information of the stage device within the XY plane, a first mark detection system that can detect subject marks including alignment marks on the other wafer held by the stage device, and a second mark detection system fixed to a part (the second table) of the stage device that can detect subject marks including alignment marks on the one wafer held by the first table.

First claim

What is claimed is:

1. A substrate bonding method of bonding a first substrate and a second substrate, the method comprising:
detecting a mark of the second substrate held by a second member, using a first detection system, the second member being capable of opposing a first member that holds the first substrate;
detecting a mark of the first substrate held by the first member, using a second detection system that is movable with respect to the first detection system; and
overlaying the first substrate and the second substrate based on results of the detecting the mark of the second substrate and the detecting the mark of the first substrate,
wherein in at least one of the detecting the mark of the second substrate and the detecting the mark of the first substrate, the first detection system is opposed to the second substrate when the second detection system is opposed to the first substrate, and
wherein the detecting the mark of the second substrate and the detecting the mark of the first substrate are performed at least partially concurrently.

2. The substrate bonding method according to claim 1 , wherein in at least one of the detecting the mark of the second substrate and the detecting the mark of the first substrate, a mark detection system is used as the first detection system or the second detection system, the mark detection system being capable of simultaneously detecting a plurality of marks arranged on a substrate subject to the detection.

3. The substrate bonding method according to claim 2 , wherein the mark detection system capable of simultaneously detecting the plurality of marks includes a plurality of detection devices that are configured to individually detect each of the plurality of marks.

4. The substrate bonding method according to claim 3 , wherein of the plurality of detection devices, one detection device and the other detection device are relatively movable within a two-dimensional plane.

5. The substrate bonding method according to claim 1 , wherein when at least a part of the first detection system and at least a part of the second detection system are opposed to each other, a section, in which the first substrate is mounted, of the first member and a section, in which the second substrate is mounted, of the second member are located on sides opposite to each other with respect to a center of an opposed section of the first detection system that is opposed to the second detection system.

6. The substrate bonding method according to claim 1 , wherein the second member includes a stage main section that is movable within a two-dimensional plane and a table that is movable at least in a direction orthogonal to the two-dimensional plane on the stage main section and holds the second substrate, and the second detection system is arranged on the table.

7. The substrate bonding method according to claim 6 , wherein a position measuring system that measures positional information of the second member at least within the two-dimensional plane is prepared, the table is movable in a predetermined range in the direction orthogonal to the two-dimensional plane that includes a position at which a surface of the second substrate held by the table is positioned at a detection point of the first detection system, and the position measuring system is further configured to measure positional information of the table in the direction orthogonal to the two-dimensional plane.

8. The substrate bonding method according to claim 6 , wherein the table is configured to be tilted with respect to the stage main section, and the position measuring system is further configured to measure tilt information of the table.

9. The substrate bonding method according to claim 1 , further comprising: measuring a separation distance between the first substrate held by the first member and the second substrate held by the second member.

10. The substrate bonding method according to claim 1 , wherein, in the detecting the mark of the second substrate, positional information at least within a two-dimensional plane of the second member is measured using a position measuring system, and the position measuring system includes a plurality of interferometers, each of which irradiates a reflection surface arranged on a part of the second member with a measurement beam.

11. The substrate bonding method according to claim 1 , wherein a detection subject of the first detection system further includes a first fiducial mark, and a detection subject of the second detection system further includes a second fiducial mark.

12. The substrate bonding method according to claim 11 , wherein the first fiducial mark and the second fiducial mark are the same.

13. The substrate bonding method according to claim 12 , wherein the second fiducial mark is detected using the second detection system, concurrently with the first fiducial mark being detected using the first detection system.

14. The substrate bonding method according to claim 1 , wherein the first member and the second member respectively hold the first substrate and the second substrate each via a substrate holding member.

15. The substrate bonding method according to claim 1 , further comprising:
detecting a common fiducial mark, using each of the first detection system and the second detection system, wherein
in the detecting the mark of the second substrate, a plurality of the marks of the second substrate are detected using the first detection system, and positional information of the second member at the time of detection of the plurality of the marks is measured;
in the detecting the mark of the first substrate, a plurality of the marks of the first substrate are detected using the second detection system, and the positional information of the second member at the time of detection of the plurality of the marks is measured; and
in the overlaying the first substrate and the second substrate, the first substrate and the second substrate are overlaid based on results of the detecting the mark of the second substrate and the detecting the mark of the first substrate and a result of the detecting the common fiducial mark.

16. The substrate bonding method according to claim 15 , wherein, in the detecting the mark of the second substrate, prior to the detection of the plurality of the marks, at least a section, which holds the second substrate, of the second member is driven in a direction orthogonal to a two-dimensional plane and a surface of the second substrate is positioned at a detection point of the first detection system.

17. The substrate bonding method according to claim 16 , wherein, in the detecting the mark of the second substrate, after the detection of the plurality of the marks, at least the section, which holds the second substrate, of the second member is driven in the direction orthogonal to the two-dimensional plane and the surface of the second substrate is withdrawn from the detection point of the first detection system.

18. The substrate bonding method according to claim 15 , wherein, in the detecting the mark of the first substrate, prior to the detection of the plurality of the marks, the first member is driven in a direction orthogonal to a two-dimensional plane and a surface of the first substrate is positioned at a detection point of the second detection system.

19. The substrate bonding method according to claim 15 , wherein, further in the detecting the common fiducial mark, a baseline of the second detection system with respect to the first detection system is obtained.

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Assignees

• Nikon Corp

Inventors

• Horikoshi Takahiro

Classifications

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10W46/501

  for use before dicing · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/201

  located on the periphery of wafers, e.g. orientation notches or lot numbers · CPC title