Thin film superconducting wire and superconducting cable conductor

Patent metadata

Field	Value
Publication number	US-9255320-B2
Application number	US-200913133274-A
Country	US
Kind code	B2
Filing date	Dec 3, 2009
Priority date	Mar 11, 2009
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

A thin film superconducting wire with a copper plating thin film produced on a surface of a laminated structure is inferior in bending properties to a thin film superconducting wire having no copper plating thin film. Therefore, a thin film superconducting wire according to the present invention is a thin film superconducting wire including a laminated structure having a substrate, a buffer layer located on one of main surfaces of the substrate, and a superconducting layer located on a main surface of the buffer layer opposite to a main surface facing the substrate. The thin film superconducting wire further includes a copper plating thin film covering an outer periphery of the laminated structure, a residual stress within the copper plating thin film serving as a compression stress. The laminated structure may have a sputtered silver layer. A silver covering layer covering the outer periphery of the laminated structure may be further provided between the copper plating thin film and the laminated structure.

First claim

The invention claimed is:

1. A thin film superconducting wire comprising:
a laminated structure including,
a substrate,
a buffer layer located on one of main surfaces of said substrate, and
a superconducting layer located on a main surface of said buffer layer opposite to a main surface facing said substrate; and

a copper plating thin film covering an outer periphery of said laminated structure, a residual stress within said copper plating thin film being a compression stress in a direction along the longitudinal extension of the thin film superconducting wire when the wire is in an unbent state, wherein
the copper plating film is plated to the outer periphery by a solution obtained by dissolving copper sulfate pentahydrate in a sulfuric acid, wherein
the solution has a copper sulfate concentration greater than or equal to 60 g/l and smaller than or equal to 150 g/l and a sulfuric acid concentration greater than or equal to 100 g/l and smaller than or equal to 220 g/l, and a thiourea concentration greater than or equal to 8 ppm and smaller than or equal to 12 ppm.

2. The thin film superconducting wire according to claim 1 , wherein said laminated structure further includes sputtered silver layers located respectively on the other of the main surfaces of the substrate not facing said buffer layer and on a main surface of said superconducting layer not facing said buffer layer.

3. The thin film superconducting wire according to claim 1 , further comprising a silver covering layer covering the outer periphery of said laminated structure between said copper plating thin film and said laminated structure.

4. The thin film superconducting wire according to claim 1 , wherein the compression stress is greater than or equal to 4 MPa and is less than or equal to 300 MPa.

5. A superconducting cable conductor comprising the thin film superconducting wire as defined in claim 1 .

Assignees

• Taneda Takahiro
• Nagaishi Tatsuoki
• Sumitomo Electric Industries

Inventors

• Taneda Takahiro
• Nagaishi Tatsuoki

Classifications

• C23C28/322

  only coatings of metal elements only · CPC title

• C25D7/0607

  Wires · CPC title

• Y02E40/642

  Cross-Sectional Technologies · mapped topic

• C25D5/34

  Pretreatment of metallic surfaces to be electroplated · CPC title

• Y10T428/2933

  Coated or with bond, impregnation or core · CPC title